Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12234145 | Methods for wafer bonding | Chien-Wei Chang, Ren-Dou Lee, Yi-Chih Chang, Yi-Hsun Chiu, Yuan-Hsin Chi | 2025-02-25 |
| 12138735 | Multi-layered windows for use in chemical-mechanical planarization systems | Shih Chung Chen, Yi-Shao Lin, Sheng-Tai Peng, Hung-Lin Chen, Ren-Dou Lee | 2024-11-12 |
| 11851325 | Methods for wafer bonding | Chien-Wei Chang, Ren-Dou Lee, Yi-Chih Chang, Yi-Hsun Chiu, Yuan-Hsin Chi | 2023-12-26 |