Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12258265 | Bonding process for forming semiconductor device structure | I-Shi Wang, Jen-Hao Liu | 2025-03-25 |
| 12244330 | Transmission device | — | 2025-03-04 |
| 12185530 | Anti-fuse sensing device and operation method thereof | — | 2024-12-31 |
| 12007800 | Power voltage supply device with automatic temperature compensation | — | 2024-06-11 |
| 11772963 | Bonding process for forming semiconductor device structure | I-Shi Wang, Jen-Hao Liu | 2023-10-03 |
| 11626177 | Anti-fuse sensing device and operation method thereof | — | 2023-04-11 |
| 11211354 | Systems and methods for semi-flexible eutectic bonder piece arranegments | Richard Huang, I-Shi Wang, Yin-Tun Chou, Jen-Hao Liu | 2021-12-28 |
| 11192775 | Rough layer for better anti-stiction deposition | I-Shi Wang, Jen-Hao Liu | 2021-12-07 |
| 11174156 | Bonding process for forming semiconductor device structure | I-Shi Wang, Jen-Hao Liu | 2021-11-16 |
| 10626010 | Bonding process for forming semiconductor device structure | I-Shi Wang, Jen-Hao Liu | 2020-04-21 |
| 10273141 | Rough layer for better anti-stiction deposition | I-Shi Wang, Jen-Hao Liu | 2019-04-30 |
| 10112826 | Method for forming micro-electro-mechanical system (MEMS) device structure | Jen-Hao Liu, I-Shi Wang | 2018-10-30 |
| 9725312 | Preconditioning to enhance hydrophilic fusion bonding | Chien-Ning Hsin, I-Shi Wang, Jen-Hao Liu | 2017-08-08 |