Issued Patents All Time
Showing 1–22 of 22 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12198910 | Permeance magnetic assembly | Tsung-Jen Yang, Yi-Zhen Chen, Chih-Pin WANG, Chao-Li Shih, Cheng-Yi Huang | 2025-01-14 |
| 12125746 | Passivation layer for integrated circuit structure and forming the same | Chun-Chiang Chen, Chun-Ting Wu, Chih-Pin WANG | 2024-10-22 |
| 11854776 | Permeance magnetic assembly | Tsung-Jen Yang, Yi-Zhen Chen, Chih-Pin WANG, Chao-Li Shih, Cheng-Yi Huang | 2023-12-26 |
| 11721662 | Wafer bonding method and wafer bonding apparatus | Yun-Tai Shih, Chyi-Tsong Ni, I-Shi Wang, Jeng-Hao Lin, Kuan-Ming Pan +2 more | 2023-08-08 |
| 11695150 | Semiconductor structures having a micro-battery and methods for making the same | Chyi-Tsong Ni, I-Shi Wang, Yi-Hsun Chiu | 2023-07-04 |
| 11688633 | Passivation layer for integrated circuit structure and forming the same | Chun-Chiang Chen, Chun-Ting Wu, Chih-Pin WANG | 2023-06-27 |
| 11488814 | Permeance magnetic assembly | Tsung-Jen Yang, Yi-Zhen Chen, Chih-Pin WANG, Chao-Li Shih, Cheng-Yi Huang | 2022-11-01 |
| 11211301 | Semiconductor device and method of manufacture | Chunting Wu, Chih-Pin WANG | 2021-12-28 |
| 11101491 | Semiconductor structures having a micro-battery and methods for making the same | Chyi-Tsong Ni, I-Shi Wang, Yi-Hsun Chiu | 2021-08-24 |
| 11069562 | Passivation layer for integrated circuit structure and forming the same | Chun-Chiang Chen, Chun-Ting Wu, Chih-Pin WANG | 2021-07-20 |
| 10847490 | Bonding alignment tool | Yun-Tai Shih, Kuan-Ming Pan, Jeng-Hao Lin, I-Shi Wang, Jui-Mu Cho +2 more | 2020-11-24 |
| 10396054 | Bonding alignment tool | Yun-Tai Shih, Kuan-Ming Pan, Jeng-Hao Lin, I-Shi Wang, Jui-Mu Cho +2 more | 2019-08-27 |
| 10361449 | Semiconductor structures having a micro-battery and methods for making the same | Chyi-Tsong Ni, I-Shi Wang, Yi-Hsun Chiu | 2019-07-23 |
| 9776857 | Methods of fabricating micro electro mechanical system structures | Ting-Ying Chien, Chyi-Tsong Ni, Yi-Hsun Chiu | 2017-10-03 |
| 9650243 | Method and apparatus for a seal ring structure | Ting-Ying Chen, Yi-Hsun Chiu, Chyi-Tsong Ni | 2017-05-16 |
| 9444398 | Semiconductor structure and fabricating process for the same | Chyi-Tsong Ni, I-Shi Wang, Yi-Hsun Chiu | 2016-09-13 |
| 9368390 | Semiconductor apparatus | Chyi-Tsong Ni, I-Shi Wang, Hsin-Kuei Lee | 2016-06-14 |
| 9287188 | Method and apparatus for a seal ring structure | Ting-Ying Chen, Yi-Hsun Chiu, Chyi-Tsong Ni | 2016-03-15 |
| 9139423 | Micro electro mechanical system structures | Ting-Ying Chien, Yi-Hsun Chiu, Chyi-Tsong Ni | 2015-09-22 |
| 9123754 | Bonding alignment tool and method | Yun-Tai Shih, Kuan-Ming Pan, Jeng-Hao Lin, I-Shi Wang, Jui-Mu Cho +2 more | 2015-09-01 |
| 8741738 | Method of fabrication of a semiconductor apparatus comprising substrates including Al/Ge and Cu contact layers to form a metallic alloy | Yi-Hsun Chiu, Ting-Ying Chien, Chyi-Tsong Ni | 2014-06-03 |
| 8378490 | Semiconductor apparatus including a metal alloy between a first contact and a second contact | Chyi-Tsong Ni, I-Shi Wang, Hsin-Kuei Lee | 2013-02-19 |