Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11721662 | Wafer bonding method and wafer bonding apparatus | Yun-Tai Shih, Ching-Hou Su, Chyi-Tsong Ni, I-Shi Wang, Jeng-Hao Lin +2 more | 2023-08-08 |
| 10847490 | Bonding alignment tool | Yun-Tai Shih, Kuan-Ming Pan, Jeng-Hao Lin, I-Shi Wang, Ching-Hou Su +2 more | 2020-11-24 |
| 10396054 | Bonding alignment tool | Yun-Tai Shih, Kuan-Ming Pan, Jeng-Hao Lin, I-Shi Wang, Ching-Hou Su +2 more | 2019-08-27 |
| 10345254 | Detection method for electroplating process | Yung-Chang Huang, Chien-Hsun Pan, Chun-Chih Lin | 2019-07-09 |
| 9123754 | Bonding alignment tool and method | Yun-Tai Shih, Kuan-Ming Pan, Jeng-Hao Lin, I-Shi Wang, Ching-Hou Su +2 more | 2015-09-01 |