Issued Patents All Time
Showing 176–200 of 261 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11121256 | Semiconductor device integrating backside power grid and related integrated circuit and fabrication method | Chih-Liang Chen, Lei-Chun Chou, Jack Liu, Kam-Tou Sio, Hui-Ting Yang +3 more | 2021-09-14 |
| 11100273 | Integrated circuit and method of manufacturing same | Shih-Wei Peng, Chih-Liang Chen, Charles Chew-Yuen Young, Hui-Zhong Zhuang, Shun Li Chen +1 more | 2021-08-24 |
| 11088092 | Via rail solution for high power electromigration | Kam-Tou Sio, Chih-Ming Lai, Chun-Kuang Chen, Chih-Liang Chen, Charles Chew-Yuen Young +3 more | 2021-08-10 |
| 11080454 | Integrated circuit, system, and method of forming the same | Shih-Wei Peng, Chih-Ming Lai | 2021-08-03 |
| 11063005 | Via rail solution for high power electromigration | Kam-Tou Sio, Chih-Ming Lai, Chun-Kuang Chen, Chih-Liang Chen, Charles Chew-Yuen Young +3 more | 2021-07-13 |
| 11055469 | Power structure with power pick-up cell connecting to buried power rail | Shih-Wei Peng, Wei-Cheng Lin | 2021-07-06 |
| 11048848 | Semiconductor device including region having both continuous regions, and method and system for generating layout diagram of same | Shih-Wei Peng, Chun-Hung Liou | 2021-06-29 |
| 11043426 | Dummy MOL removal for performance enhancement | Hui-Ting Yang, Chih-Ming Lai, Chun-Kuang Chen, Chih-Liang Chen, Charles Chew-Yuen Young +4 more | 2021-06-22 |
| 11024579 | Dual power structure with connection pins | Shih-Wei Peng, Chih-Ming Lai, Chun-Kuang Chen, Chih-Liang Chen, Charles Chew-Yuen Young +3 more | 2021-06-01 |
| 11024580 | Random cut patterning | Shih-Wei Peng, Wei-Cheng Lin, Chih-Ming Lai | 2021-06-01 |
| 11018157 | Local interconnect structure | Chih-Liang Chen, Cheng-Chi Chuang, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young +5 more | 2021-05-25 |
| 10977421 | System for and method of manufacturing an integrated circuit | Wei-Cheng Lin, Chih-Liang Chen, Chih-Ming Lai, Charles Chew-Yuen Young, Kam-Tou Sio +3 more | 2021-04-13 |
| 10977417 | Semiconductor structure, device, and method | Shih-Wei Peng, Wei-Cheng Lin | 2021-04-13 |
| 10971493 | Integrated circuit device with high mobility and system of forming the integrated circuit | Kam-Tou Sio, Shang-Wei Fang, CHEW-YUEN YOUNG | 2021-04-06 |
| 10964684 | Multiple fin height integrated circuit | Wei-Cheng Lin, Hui-Ting Yang, Lipen Yuan, Wei-An Lai | 2021-03-30 |
| 10950456 | High-density semiconductor device | Lei-Chun Chou, Chih-Liang Chen, Chih-Ming Lai, Charles Chew-Yuen Young, Chin-Yuan Tseng +6 more | 2021-03-16 |
| 10879173 | Middle-end-of-line strap for standard cell | Meng-Hung Shen, Chih-Liang Chen, Charles Chew-Yuen Young, Kam-Tou Sio, Wei-Cheng Lin | 2020-12-29 |
| 10879229 | Integrated circuit, system for and method of forming an integrated circuit | Kam-Tou Sio, Chih-Liang Chen, Charles Chew-Yuen Young, Hui-Zhong Zhuang, Yi-Hsun Chiu | 2020-12-29 |
| 10879120 | Self aligned via and method for fabricating the same | Chih-Liang Chen, Cheng-Chi Chuang, Chih-Ming Lai, Chia-Tien Wu, Charles Chew-Yuen Young +4 more | 2020-12-29 |
| 10878162 | Metal with buried power for increased IC device density | Shih-Wei Peng, Chih-Ming Lai, Hui-Ting Yang, Wei-Cheng Lin | 2020-12-29 |
| 10878161 | Method and structure to reduce cell width in integrated circuits | Shih-Wei Peng, Chih-Ming Lai, Wei-Cheng Lin | 2020-12-29 |
| 10878158 | Semiconductor device including cell region having more similar cell densities in different height rows, and method and system for generating layout diagram of same | Wei-Cheng Lin, Hui-Ting Yang, Lipen Yuan, Wei-An Lai | 2020-12-29 |
| 10867833 | Buried metal for FinFET device and method | Lei-Chun Chou, Chih-Liang Chen, Chih-Ming Lai, Ru-Gun Liu, Charles Chew-Yuen Young | 2020-12-15 |
| 10868008 | Double rule integrated circuit layouts for a dual transmission gate | Shih-Wei Peng, Hui-Zhong Zhuang, Li-Chun Tien, Pin-Dai Sue, Wei-Cheng Lin | 2020-12-15 |
| 10867917 | Semiconductor device, associated method and layout | Shih-Wei Peng, Hui-Ting Yang, Wei-Cheng Lin | 2020-12-15 |