Issued Patents All Time
Showing 26–50 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11443984 | Semiconductor device and a method for fabricating the same | Hsiang-Ku Shen, Jeng-Ya David Yeh | 2022-09-13 |
| 11437331 | Chip structure and method for forming the same | Chih-Fan Huang, Mao-Nan Wang, Dian-Hau Chen, Yen-Ming Chen | 2022-09-06 |
| 11404558 | Semiconductor device and a method for fabricating the same | Yao-De Chiou, Jeng-Ya David Yeh | 2022-08-02 |
| 11380639 | Shielding structures | Chih-Fan Huang, Kuo-Chin Chang, Chien-Huang Yeh, Hong-Seng Shue, Dian-Hau Chen +1 more | 2022-07-05 |
| 11362170 | Metal-insulator-metal (MIM) capacitor structure and method for forming the same | Chih-Fan Huang, Chih-Yang Pai, Yuan-Yang Hsiao, Tsung-Chieh Hsiao, Dian-Hau Chen +1 more | 2022-06-14 |
| 11342408 | Metal-insulator-metal structure and methods of fabrication thereof | Chih-Fan Huang, Hung-Chao Kao, Yuan-Yang Hsiao, Tsung-Chieh Hsiao, Hsiang-Ku Shen +2 more | 2022-05-24 |
| 11239142 | Package structure and method for forming the same | Chih-Fan Huang, Hsiang-Ku Shen, Tien-I Bao, Dian-Hau Chen, Yen-Ming Chen | 2022-02-01 |
| 11222946 | Semiconductor device including a high density MIM capacitor and method | Jin-Mu Yin, Hung-Chao Kao, Dian-Hau Chen, Hsiang-Ku Shen, Yen-Ming Chen | 2022-01-11 |
| 11189538 | Semiconductor structure with polyimide packaging and manufacturing method | Chih-Fan Huang, Mao-Nan Wang, Kuo-Chin Chang, Dian-Hau Chen, Yen-Ming Chen | 2021-11-30 |
| 11145564 | Multi-layer passivation structure and method | Chih-Fan Huang, Kuo-Chin Chang, Dian-Hau Chen, Yen-Ming Chen | 2021-10-12 |
| 11056556 | Metal-insulator-metal capacitive structure and methods of fabricating thereof | Hsiang-Ku Shen, Ming-Hong Kao, Dian-Hau Chen, Yen-Ming Chen | 2021-07-06 |
| 11031458 | Metal-insulator-metal (MIM) capacitor structure and method for forming the same | Chih-Fan Huang, Chih-Yang Pai, Yuan-Yang Hsiao, Tsung-Chieh Hsiao, Dian-Hau Chen +1 more | 2021-06-08 |
| 10861810 | Shielding structures | Chih-Fan Huang, Kuo-Chin Chang, Chien-Huang Yeh, Hong-Seng Shue, Dian-Hau Chen +1 more | 2020-12-08 |
| 10734283 | Semiconductor device and a method for fabricating the same | Hsiang-Ku Shen, Jeng-Ya David Yeh | 2020-08-04 |
| 10734474 | Metal-insulator-metal structure and methods of fabrication thereof | Chih-Fan Huang, Hung-Chao Kao, Yuan-Yang Hsiao, Tsung-Chieh Hsiao, Hsiang-Ku Shen +2 more | 2020-08-04 |
| 10529824 | Semiconductor device and method for fabricating the same | Yao-De Chiou, Jeng-Ya David Yeh | 2020-01-07 |
| 10468478 | Metal-insulator-metal (MIM) capacitor structure and method for forming the same | Chih-Fan Huang, Chih-Yang Pai, Yuan-Yang Hsiao, Tsung-Chieh Hsiao, Dian-Hau Chen +1 more | 2019-11-05 |
| 10163704 | Semiconductor device and a method for fabricating the same | Hsiang-Ku Shen, Jeng-Ya David Yeh | 2018-12-25 |
| 10101857 | Methods for integrating a compliant material with a substrate | Po-Jui Chen, Kuo-Hua Sung | 2018-10-16 |
| 9891770 | Methods for forming a patterned structure in a sensor | Po-Jui Chen, Soyoung Kim, Kuo-Hua Sung, Rui Qiao | 2018-02-13 |
| 8815744 | Technique for controlling trench profile in semiconductor structures | Qi Wang, Briant Harward, James Pan | 2014-08-26 |
| 8198196 | High aspect ratio trench structures with void-free fill material | James J. Murphy, Eileen Valdez | 2012-06-12 |
| 8039401 | Structure and method for forming hybrid substrate | Qi Wang, Joelle Sharp, Minhua Li | 2011-10-18 |
| 8003522 | Method for forming trenches with wide upper portion and narrow lower portion | Ihsiu Ho, Stacy W. Hall, Briant Harward, Hossein Paravi | 2011-08-23 |
| 7956411 | High aspect ratio trench structures with void-free fill material | James J. Murphy, Eileen Valdez | 2011-06-07 |