Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8198196 | High aspect ratio trench structures with void-free fill material | James J. Murphy, Hui-Chi Chen | 2012-06-12 |
| 7956411 | High aspect ratio trench structures with void-free fill material | James J. Murphy, Hui-Chi Chen | 2011-06-07 |