Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515239 | Quad flat no-lead package structure | Tai-Hung Lin, Jhih-Siou Cheng | 2022-11-29 |
| 11244891 | Integrated circuit package and die | Jhih-Siou Cheng, Chun-Wei Kang, Chun-Fu Lin, Ju-Lin Huang | 2022-02-08 |
| 8970015 | Method for protecting a gate structure during contact formation | Pei-Chao Su, Kong-Beng Thei, Hun-Jan Tao, Harry-Hak-Lay Chuang | 2015-03-03 |
| 8648446 | Method for protecting a gate structure during contact formation | Pei-Chao Su, Kong-Beng Thei, Hun-Jan Tao, Harry-Hak-Lay Chuang | 2014-02-11 |
| 8530326 | Method of fabricating a dummy gate structure in a gate last process | Su-Chen Lai, Ming-Yuan Wu, Kong-Beng Thei, Hak-Lay Chuang, Chiung-Han Yeh +3 more | 2013-09-10 |
| 8497169 | Method for protecting a gate structure during contact formation | Pei-Chao Su, Kong-Beng Thei, Hun-Jan Tao, Harry-Hak-Lay Chuang | 2013-07-30 |
| 8237227 | Dummy gate structure for gate last process | Su-Chen Lai, Ming-Yuan Wu, Kong-Beng Thei, Harry-Hak-Lay Chuang, Chiung-Han Yeh +3 more | 2012-08-07 |
| 8202776 | Method for protecting a gate structure during contact formation | Pei-Chao Su, Kong-Beng Thei, Hun-Jan Tao, Harry-Hak-Lay Chuang | 2012-06-19 |