Issued Patents All Time
Showing 26–35 of 35 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7081679 | Structure and method for reinforcing a bond pad on a chip | Tai-Chun Huang | 2006-07-25 |
| 7074629 | Test patterns for measurement of effective vacancy diffusion area | Tai-Chun Huang | 2006-07-11 |
| 7042097 | Structure for reducing stress-induced voiding in an interconnect of integrated circuits | Chin-Chiu Hsia, Wen-Kai Wan | 2006-05-09 |
| 6927498 | Bond pad for flip chip package | Tai-Chun Huang, Ching-Hua Hsieh | 2005-08-09 |
| 6864701 | Test patterns for measurement of effective vacancy diffusion area | Tai-Chun Huang | 2005-03-08 |
| 6831365 | Method and pattern for reducing interconnect failures | Wen-Kai Wan, Tai-Chun Huang, Chin-Chiu Hsia | 2004-12-14 |
| 6812069 | Method for improving semiconductor process wafer CMP uniformity while avoiding fracture | Tung-Ching Tseng, Syun-Ming Jang | 2004-11-02 |
| 6787484 | Method of reducing visible light induced arcing in a semiconductor wafer manufacturing process | Yun-Cheng Lu | 2004-09-07 |
| 6787803 | Test patterns for measurement of low-k dielectric cracking thresholds | Tai-Chun Huang | 2004-09-07 |
| 6759342 | Method of avoiding dielectric arcing | Lain-Jong Li, Bi-Troug Chen, Syun-Ming Jan | 2004-07-06 |