Issued Patents All Time
Showing 26–29 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7338903 | Sequential reducing plasma and inert plasma pre-treatment method for oxidizable conductor layer | Jing-Cheng Lin, Ching-Hua Hsieh, Shau-Lin Shue | 2008-03-04 |
| 7253501 | High performance metallization cap layer | Hsien-Ming Lee, Jing-Cheng Lin, Shing-Chyang Pan, Ching-Hua Hsieh, Cheng-Lin Huang +2 more | 2007-08-07 |
| 7202162 | Atomic layer deposition tantalum nitride layer to improve adhesion between a copper structure and overlying materials | Jing-Cheng Lin, Shau-Lin Shue, Mong-Song Liang | 2007-04-10 |
| 7078810 | Semiconductor device and fabrication method thereof | Gin Jie Wang, Chii-Ming Wu, Chih-Wei Chang, Shau-Lin Shue | 2006-07-18 |