Issued Patents All Time
Showing 26–50 of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6300576 | Printed-circuit board having projection electrodes and method for producing the same | Yoshifumi Nakamura, Minehiro Itagaki, Hiroaki Takezawa, Tsukasa Shiraishi | 2001-10-09 |
| 6284640 | Manufacturing method for semiconductor device, mounting method of semiconductor device, semiconductor device, and inspecting method of semiconductor device | Masahiro Ono, Tsukasa Shiraishi, Kazuo Eda | 2001-09-04 |
| 6229209 | Chip carrier | Yoshifumi Nakamura, Minehiro Itagaki | 2001-05-08 |
| 6207550 | Method for fabricating bump electrodes with a leveling step for uniform heights | Nobuhiro Hase, Minehiro Itagaki, Yoshifumi Nakamura, Satoru Yuhaku, Hiroaki Takezawa | 2001-03-27 |
| 6154940 | Electronic part and a method of production thereof | Keiji Onishi, Hideki Iwaki, Shun-ichi Seki, Yutaka Taguchi, Tsukasa Shiraishi +2 more | 2000-12-05 |
| 6103551 | Semiconductor unit and method for manufacturing the same | Masahiro Ono | 2000-08-15 |
| 6088236 | Semiconductor device having a bump having a rugged side | Yoshihiro Tomura | 2000-07-11 |
| 5940679 | Method of checking electric circuits of semiconductor device and conductive adhesive for checking usage | Yoshihiro Tomura, Yoshifumi Nakamura | 1999-08-17 |
| 5920142 | Electronic part and a method of production thereof | Keiji Onishi, Hideki Iwaki, Shun-ichi Seki, Yutaka Taguchi, Tsukasa Shiraishi +2 more | 1999-07-06 |
| 5844320 | Semiconductor unit with semiconductor device mounted with conductive adhesive | Masahiro Ono | 1998-12-01 |
| 5688441 | Thixotropic conductive paste | Minehiro Itagaki, Satoru Yuhaku, Yasuhiko Hakotani, Kazuhiro Miura, Kazuyuki Okano | 1997-11-18 |
| 5670826 | Method for mounting a semiconductor device on a circuit board using a conductive adhesive and a thermosetting resin, and a circuit board with a semiconductor device mounted thereon using the method | Yoshihiro Tomura | 1997-09-23 |
| 5662755 | Method of making multi-layered ceramic substrates | Kazuhiro Miura, Satoru Yuhaku, Yasuhiko Hakotani, Minehiro Itagaki, Yoshifumi Nakamura +1 more | 1997-09-02 |
| 5651179 | Method for mounting a semiconductor device on a circuit board | Yoshihiro Tomura | 1997-07-29 |
| 5641996 | Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging | Kazunori Omoya, Takashi Oobayashi, Wataru Sakurai, Mitsuru Harada | 1997-06-24 |
| 5640051 | Chip package, a chip carrier, a terminal electrode for a circuit substrate and a chip package-mounted complex | Yoshihiro Tomura, Yasuhiko Hakotani | 1997-06-17 |
| 5628919 | Methods for producing a chip carrier and terminal electrode for a circuit substrate | Yoshihiro Tomura, Yasuhiko Hakotani | 1997-05-13 |
| 5547530 | Method of manufacturing a ceramic substrate | Yoshifumi Nakamura, Satoru Yuhaku, Yasuhiko Hakotani, Minehiro Itagaki, Kazuhiro Miura | 1996-08-20 |
| 5545589 | Method of forming a bump having a rugged side, a semiconductor device having the bump, and a method of mounting a semiconductor unit and a semiconductor device | Yoshihiro Tomura | 1996-08-13 |
| 5525402 | Ceramic substrate and manufacturing method thereof | Yoshifumi Nakamura, Satoru Yuhaku, Yasuhiko Hakotani, Minehiro Itagaki, Kazuhiro Miura | 1996-06-11 |
| 5503777 | Thixotropic conductive paste | Minehiro Itagaki, Satoru Yuhaku, Yasuhiko Hakotani, Kazuhiro Miura, Kazuyuki Okano | 1996-04-02 |
| 5496619 | Assembly formed from conductive paste and insulating paste | Minehiro Itagaki, Kazuyuki Okano, Suzushi Kimura, Seiichi Nakatani, Satoru Yuhaku +2 more | 1996-03-05 |
| 5485949 | Capillary for a wire bonding apparatus and a method for forming an electric connection bump using the capillary | Yoshihiro Tomura | 1996-01-23 |
| 5407473 | Conductive ink | Kazuhiro Miura, Satoru Yuhaku, Yasuhiko Hakotani, Minehiro Itagaki, Yoshifumi Nakamura +1 more | 1995-04-18 |
| 5090119 | Method of forming an electrical contact bump | Toshio Tsuda, Yasuhiko Horio, Toru Ishida | 1992-02-25 |