Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6139777 | Conductive paste for filling via-hole, double-sided and multilayer printed circuit boards using the same, and method for producing the same | Kazunori Omoya, Takeshi Suzuki, Tatsuo Ogawa | 2000-10-31 |
| 5641996 | Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging | Kazunori Omoya, Wataru Sakurai, Mitsuru Harada, Yoshihiro Bessho | 1997-06-24 |