Issued Patents All Time
Showing 126–134 of 134 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5614328 | Reflow-plated member and a manufacturing method therefor | Satoshi Suzuki, Teruo KAWADA, Yuuji Suzuki, Morimasa Tanimoto | 1997-03-25 |
| 5431324 | Ultrasonic bonding apparatus and quality monitoring method | Ryoichi Kajiwara, Mituo Katou, Minoru Maruta, Tokiyuki Seto, Kunihiro Tsubosaki | 1995-07-11 |
| 5397403 | High strength amorphous aluminum-based alloy member | Hiroyuki Horimura, Tadahiro Kubota, Tuyoshi Baba | 1995-03-14 |
| 5323952 | Bonding apparatus and testing apparatus of a bonded portion | Mituo Kato, Ryoichi Kajiwara, Setuo Sekine, Tokiyuki Seto | 1994-06-28 |
| 5304512 | Process for manufacturing semiconductor integrated circuit device, and molding apparatus and molding material for the process | Katsuo Arai, Sumio Okada, Takashi Ooba, Mayumi Kaneko | 1994-04-19 |
| 5216895 | Engine idle speed control system for automotive vehicle | Nobuyuki Kawai, Ikutaro Noji, Makoto Fukubayashi, Shozo Nakayama, Naoki Nakada +1 more | 1993-06-08 |
| 4954906 | Position control system for a magnetic storage device using a small sized disk | Yoshihiro Nakamura, Atsuki Ichinose, Testuya Mino | 1990-09-04 |
| 4809058 | Integrated circuit device | Takao Funamoto, Ryoichi Kajiwara, Mituo Katou, Takeshi Matsuzaka, Tomohiko Shida +5 more | 1989-02-28 |
| 4740866 | Sealed-type liquid cooling device with expandable bellow for semiconductor chips | Ryoichi Kajiwara, Takao Funamoto, Mitsuo Katoo, Tomohiko Shida, Takeshi Matsuzaka +1 more | 1988-04-26 |