Issued Patents All Time
Showing 26–41 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8143533 | Method for forming resist pattern, method for producing circuit board, and circuit board | Yasuo Kaneda, Munetoshi Irisawa, Yuji Toyoda, Toyokazu Komuro, Toyoaki Sakai | 2012-03-27 |
| 8066862 | Manufacturing method of wiring board | Tomoo Yamasaki | 2011-11-29 |
| 7999193 | Wiring substrate and method of manufacturing the same | Kishio Yokouchi, Hideaki Yoshimura | 2011-08-16 |
| 7679004 | Circuit board manufacturing method and circuit board | Toyoaki Sakai, Munetoshi Irisawa, Toyokazu Komuro, Yasuo Kaneda, Masanori Natsuka +1 more | 2010-03-16 |
| 7454832 | Method of forming metal plate pattern and circuit board | Toyoaki Sakai | 2008-11-25 |
| 7415762 | Interposer, method of fabricating the same, and semiconductor device using the same | Shinichi Wakabayashi | 2008-08-26 |
| 7388293 | Interposer method of fabricating same, and semiconductor device using the same having two portions with different constructions | Shinichi Wakabayashi | 2008-06-17 |
| 7005241 | Process for making circuit board or lead frame | Toyoaki Sakai | 2006-02-28 |
| 5909053 | Lead frame and method for manufacturing same | Takahiro Iijima, Masao Nakazawa, Shinichi Wakabayashi | 1999-06-01 |
| 5656855 | Lead frame and method for manufacturing same | Takahiro Iijima, Masao Nakazawa, Shinichi Wakabayashi | 1997-08-12 |
| 5643433 | Lead frame and method for manufacturing same | Takahiro Iijima, Masao Nakazawa, Shinichi Wakabayashi | 1997-07-01 |
| 5293301 | Semiconductor device and lead frame used therein | Masato Tanaka, Mitsuharu Shimizu, Toshiyuki Murakami | 1994-03-08 |
| 5183711 | Automatic bonding tape used in semiconductor device | Norio Wada, Hirofumi Uchida | 1993-02-02 |
| 5087530 | Automatic bonding tape used in semiconductor device | Norio Wada, Hirofumi Uchida | 1992-02-11 |
| 4969257 | Transfer sheet and process for making a circuit substrate | Takeshi Sato, Hirofumi Uchida, Kiyotaka Shimada | 1990-11-13 |
| 4867839 | Process for forming a circuit substrate | Takeshi Sato, Kiyotaka Shimada, Hirofumi Uchida | 1989-09-19 |