Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12250773 | Wiring board and wiring board manufacturing method | Toshiaki Aoki | 2025-03-11 |
| 11818847 | Resist layer forming method, method for manufacturing wiring board, and resist layer forming apparatus | Yoshihisa Kanbe | 2023-11-14 |
| 10170405 | Wiring substrate and semiconductor package | — | 2019-01-01 |
| 9911695 | Wiring board including multiple wiring layers that are different in surface roughness | — | 2018-03-06 |
| 9699912 | Wiring board | Tomoyuki Shimodaira, Shunichiro Matsumoto, Kentaro Kaneko | 2017-07-04 |
| 8143533 | Method for forming resist pattern, method for producing circuit board, and circuit board | Yasuo Kaneda, Munetoshi Irisawa, Yuji Toyoda, Toyokazu Komuro, Katsuya Fukase | 2012-03-27 |
| 7679004 | Circuit board manufacturing method and circuit board | Katsuya Fukase, Munetoshi Irisawa, Toyokazu Komuro, Yasuo Kaneda, Masanori Natsuka +1 more | 2010-03-16 |
| 7454832 | Method of forming metal plate pattern and circuit board | Katsuya Fukase | 2008-11-25 |
| 7005241 | Process for making circuit board or lead frame | Katsuya Fukase | 2006-02-28 |