Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12101894 | Wiring board | Junichi Nakamura, Takeshi Takai, Yusuke Karasawa, Shuhei Momose, Toshiki Shirotori | 2024-09-24 |
| 11818847 | Resist layer forming method, method for manufacturing wiring board, and resist layer forming apparatus | Toyoaki Sakai | 2023-11-14 |
| 11632862 | Wiring board | Junichi Nakamura, Takeshi Takai, Yusuke Karasawa, Shuhei Momose, Toshiki Shirotori | 2023-04-18 |
| 11574866 | Wiring substrate and manufacturing method thereof | Tomoyuki Shimodaira, Takashi Sato | 2023-02-07 |
| 11211326 | Wiring substrate and manufacturing method thereof | Tomoyuki Shimodaira, Takashi Sato | 2021-12-28 |
| 11075153 | Electronic component-incorporating substrate | — | 2021-07-27 |
| 10622298 | Wiring substrate and semiconductor device | — | 2020-04-14 |