Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12101894 | Wiring board | Junichi Nakamura, Takeshi Takai, Yoshihisa Kanbe, Shuhei Momose, Toshiki Shirotori | 2024-09-24 |
| 12033802 | Multilayer capacitor having sintered electrode layer with wraparound portion | Toru Onoue, Daisuke Himeta | 2024-07-09 |
| 11632862 | Wiring board | Junichi Nakamura, Takeshi Takai, Yoshihisa Kanbe, Shuhei Momose, Toshiki Shirotori | 2023-04-18 |
| 10811348 | Method of manufacturing wiring substrate | Kazuhiro Kobayashi | 2020-10-20 |
| 9974162 | Interconnection substrate and method of inspecting interconnection substrate | Tsukasa Obinata, Hideyuki Tako, Goshi Imai, Suguru Yamato | 2018-05-15 |