Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12418981 | Wiring board | Hikaru Tanaka, Takashi Kasuga, Hitoshi Kondo | 2025-09-16 |
| 12342457 | Wiring board and manufacturing method of wiring board | Takashi Kasuga, Hikaru Tanaka, Naotaka Noguchi, Takashi Sato, Hitoshi Kondo | 2025-06-24 |
| 12191255 | Interconnect substrate having groove around pad | Hikaru Tanaka, Takashi Kasuga, Hitoshi Kondo | 2025-01-07 |
| 11574866 | Wiring substrate and manufacturing method thereof | Yoshihisa Kanbe, Takashi Sato | 2023-02-07 |
| 11211326 | Wiring substrate and manufacturing method thereof | Yoshihisa Kanbe, Takashi Sato | 2021-12-28 |
| 11001930 | Method of manufacturing wiring board | Hitoshi Kondo | 2021-05-11 |
| 10643934 | Wiring substrate and electronic component device | — | 2020-05-05 |
| 9918378 | Wiring substrate | — | 2018-03-13 |
| 9893002 | Terminal structure and wiring substrate | — | 2018-02-13 |
| 9711476 | Wiring board and electronic component device | Takahiro Rokugawa, Hitoshi Kondo | 2017-07-18 |
| 9699912 | Wiring board | Toyoaki Sakai, Shunichiro Matsumoto, Kentaro Kaneko | 2017-07-04 |
| 9232641 | Wiring board and method of manufacturing the same | Takahiro Rokugawa | 2016-01-05 |
| 8669478 | Wiring substrate and method of manufacturing the same | Hitoshi Kondo, Masako Sato | 2014-03-11 |
| 8450852 | Wiring substrate | Hitoshi Kondo, Masako Sato | 2013-05-28 |