Issued Patents All Time
Showing 1–25 of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D1022002 | Industrial camera | — | 2024-04-09 |
| D1016875 | Industrial camera | Katsuyuki Masada | 2024-03-05 |
| 11916103 | P-type oxide semiconductor and method for manufacturing same | Shizuo Fujita, Toshimi Hitora, Tomochika Tanikawa | 2024-02-27 |
| 11756866 | Lead frame and semiconductor device | Yoshio Furuhata, Konosuke Kobayashi | 2023-09-12 |
| D996502 | Industrial camera | — | 2023-08-22 |
| 11616005 | Plurality of leads having a two stage recess | Koji Watanabe, Hiroto Seki | 2023-03-28 |
| D978225 | Lens cover for camera | Issei Megumi | 2023-02-14 |
| 11424320 | P-type oxide semiconductor and method for manufacturing same | Shizuo Fujita, Toshimi Hitora, Tomochika Tanikawa | 2022-08-23 |
| 11189846 | Electrically-conductive member and method of manufacturing the same | Shizuo Fujita, Masafumi Ono, Takayuki Uchida, Takashi Tanaka, Toshimi Hitora +1 more | 2021-11-30 |
| 11152208 | Semiconductor film, method of forming semiconductor film, complex compound for doping, and method of doping | Shizuo Fujita, Takayuki Uchida, Masaya Oda, Toshimi Hitora | 2021-10-19 |
| 11087977 | P-type oxide semiconductor and method for manufacturing same | Shizuo Fujita, Masaya Oda, Toshimi Hitora | 2021-08-10 |
| 10943857 | Substrate with multi-layer resin structure and semiconductor device including the substrate | Harunobu Sato, Tsukasa Nakanishi, Junichi Nakamura, Koji Watanabe | 2021-03-09 |
| 10818579 | Lead frame and electronic component device | Shintaro Hayashi, Tsukasa Nakanishi, Misaki Imai | 2020-10-27 |
| 10580648 | Semiconductor device and method of manufacturing semiconductor device | Riena Jinno, Shizuo Fujita, Tokiyoshi Matsuda, Takashi Shinohe, Toshimi Hitora | 2020-03-03 |
| 10460934 | Crystalline film, semiconductor device including crystalline film, and method for producing crystalline film | Yuichi Oshima, Shizuo Fujita, Makoto Kasu, Katsuaki KAWARA, Takashi Shinohe +2 more | 2019-10-29 |
| 10381292 | Lead frame and method of manufacturing lead frame | Koji Watanabe | 2019-08-13 |
| 10276478 | Lead frame | Yoshio Furuhata, Mitsuharu Sato, Toshio Masuda | 2019-04-30 |
| 10201917 | Lead frame | Tsuyoshi Kobayashi, Yoshio Furuhata, Shigeri Nakamura | 2019-02-12 |
| 10117336 | Method of manufacturing a wiring substrate | Toshimitsu Omiya, Kotaro Kodani, Junichi Nakamura, Kazuhiro Kobayashi | 2018-10-30 |
| 9711590 | Semiconductor device, or crystal | Toshimi Hitora, Takashi Hirao | 2017-07-18 |
| 9699912 | Wiring board | Toyoaki Sakai, Tomoyuki Shimodaira, Shunichiro Matsumoto | 2017-07-04 |
| 9538664 | Wiring substrate | Hiroharu Yanagisawa, Kazuhiro Oshima, Junichi Nakamura | 2017-01-03 |
| 9433109 | Wiring substrate and semiconductor package | Katsuya Fukase | 2016-08-30 |
| 9345143 | Method of fabricating a wiring board | Kotaro Kodani, Kazuhiro Kobayashi | 2016-05-17 |
| 9313904 | Wiring board and method of manufacturing wiring board | Katsuya Fukase | 2016-04-12 |