Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11456200 | Substrate fixing apparatus including a base plate, an electrostatic adsorption member, a plurality of support members on the base plate and supporting the electrostatic adsorption member, and an adhesive layer bonding the electrostatic adsorption member to the base plate | Nobuyuki Iijima, Yuichi Nakamura, Ryuji Takahashi | 2022-09-27 |
| 11152293 | Wiring board having two insulating films and hole penetrating therethrough | Kazuhiro Oshima, Kazuhiro Kobayashi, Katsuya Fukase, Ken Miyairi | 2021-10-19 |
| 11088006 | Electrostatic chuck | Takamasa Yoshikawa, Nobuyuki Iijima | 2021-08-10 |
| 9966331 | Wiring substrate and semiconductor device | Takayuki Ota, Katsuya Fukase | 2018-05-08 |
| 9961767 | Circuit board and method of manufacturing circuit board | Kazuhiro Oshima, Kazuhiro Kobayashi, Katsuya Fukase, Ken Miyairi | 2018-05-01 |
| 9698094 | Wiring board and electronic component device | Kazuhiro Kobayashi | 2017-07-04 |
| 9538664 | Wiring substrate | Kentaro Kaneko, Kazuhiro Oshima, Junichi Nakamura | 2017-01-03 |