Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431434 | Built-in component board, method of manufacturing the built-in component board | Takashi Sato, Yasuyuki Yamaguchi | 2025-09-30 |
| 12418981 | Wiring board | Hikaru Tanaka, Tomoyuki Shimodaira, Hitoshi Kondo | 2025-09-16 |
| 12342457 | Wiring board and manufacturing method of wiring board | Tomoyuki Shimodaira, Hikaru Tanaka, Naotaka Noguchi, Takashi Sato, Hitoshi Kondo | 2025-06-24 |
| 12191255 | Interconnect substrate having groove around pad | Hikaru Tanaka, Tomoyuki Shimodaira, Hitoshi Kondo | 2025-01-07 |
| 11997787 | Wiring substrate and method of manufacturing wiring substrate | Hikaru Tanaka | 2024-05-28 |
| 11864312 | Printed circuit board and method of manufacturing printed circuit board | Hiroshi Ueda, Ippei TANAKA, Masamichi Yamamoto | 2024-01-02 |
| 11013113 | Base material for printed circuit board and printed circuit board | Motohiko SUGIURA, Issei Okada, Yoshio Oka, Kenji Ohki | 2021-05-18 |
| 10889086 | Resin film, substrate for printed wiring board, and printed wiring board | Kayo HASHIZUME, Yoshio Oka, Masamichi Yamamoto, Yugo Kubo, Hideki Kashihara +1 more | 2021-01-12 |
| 10842027 | Base material for printed circuit board and printed circuit board | Kazuhiro MIYATA, Yoshio Oka, Hiroshi Ueda | 2020-11-17 |
| 10596782 | Substrate for printed circuit board and printed circuit board | Kayo HASHIZUME, Yoshio Oka, Jinjoo Park, Hiroshi Ueda | 2020-03-24 |
| 10537020 | Printed circuit board and electronic component | Kohei Okamoto, Kousuke Miura, Hiroshi Ueda, Kazuhiro MIYATA | 2020-01-14 |
| 10537017 | Printed circuit board and electronic component | Kohei Okamoto, Kousuke Miura, Hiroshi Ueda, Kazuhiro MIYATA | 2020-01-14 |
| 10307825 | Metal powder, ink, sintered body, substrate for printed circuit board, and method for manufacturing metal powder | Issei Okada, Yoshio Oka, Yasuhiro Okuda, Jinjoo Park, Kousuke Miura +1 more | 2019-06-04 |
| 10292265 | Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board | Yoshio Oka, Shigeaki UEMURA, Shigeyoshi Nakayama, Jinjoo Park, Sumito Uehara +2 more | 2019-05-14 |
| 10244627 | Substrate for printed wiring board and method for producing the same, printed wiring board and method for producing the same, and resin base material | Kayo HASHIZUME, Yoshio Oka, Jinjoo Park, Kousuke Miura, Hiroshi Ueda | 2019-03-26 |
| 10237976 | Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board | Yoshio Oka, Jinjoo Park, Sumito Uehara, Kousuke Miura, Hiroshi Ueda | 2019-03-19 |
| 10225931 | Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board | Kayo HASHIZUME, Yoshio Oka, Jinjoo Park, Hiroshi Ueda | 2019-03-05 |
| 10143083 | Substrate for printed circuit board and method for producing substrate for printed circuit board | Motohiko SUGIURA, Yoshio Oka, Shigeaki UEMURA, Jinjoo Park, Hiroshi Ueda +1 more | 2018-11-27 |
| 10076028 | Substrate for printed circuit board, printed circuit board, and method for producing printed circuit board | Yoshio Oka, Shigeaki UEMURA, Jinjoo Park, Hiroshi Ueda, Kousuke Miura | 2018-09-11 |
| 10076032 | Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board | Yoshio Oka, Shigeyoshi Nakayama, Jinjoo Park, Sumito Uehara, Kousuke Miura +1 more | 2018-09-11 |
| 9967976 | Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board | Kazuhiro MIYATA, Issei Okada, Yoshio Oka, Yasuhiro Okuda, Jinjoo Park +2 more | 2018-05-08 |
| 8581118 | Seal structure, method of forming seal structure, wire body, and electronic apparatus | Hidehiko Mishima, Kazuya Maruyama | 2013-11-12 |
| 8309853 | Flexible printed wiring board | Yoshio Oka, Jinjoo Park, Kouki Nakama | 2012-11-13 |
| 7510592 | Method of producing metal powder | Masatoshi Majima, Kohei Shimoda, Issei Okada, Masahiro Yamakawa | 2009-03-31 |
| 7285438 | Solid-state imaging device and method for manufacturing solid-state imaging device | — | 2007-10-23 |