Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12058812 | Substrate for a printed wiring board | Takuto HIDANI, Haruka Okamoto | 2024-08-06 |
| 12016132 | Base material for printed circuit board and method of manufacturing base material for printed circuit board | Masamichi Yamamoto | 2024-06-18 |
| 10889086 | Resin film, substrate for printed wiring board, and printed wiring board | Yoshio Oka, Masamichi Yamamoto, Takashi Kasuga, Yugo Kubo, Hideki Kashihara +1 more | 2021-01-12 |
| 10596782 | Substrate for printed circuit board and printed circuit board | Yoshio Oka, Takashi Kasuga, Jinjoo Park, Hiroshi Ueda | 2020-03-24 |
| 10244627 | Substrate for printed wiring board and method for producing the same, printed wiring board and method for producing the same, and resin base material | Yoshio Oka, Takashi Kasuga, Jinjoo Park, Kousuke Miura, Hiroshi Ueda | 2019-03-26 |
| 10225931 | Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board | Yoshio Oka, Takashi Kasuga, Jinjoo Park, Hiroshi Ueda | 2019-03-05 |