Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12213249 | Method for manufacturing dielectric sheet, method for manufacturing substrate for high-frequency printed wiring board, dielectric sheet, and substrate for high-frequency printed wiring board | Shingo Kaimori, Takashi Ninomiya, Yasuhiro Okuda, Hideki Kashihara, Satoshi KIYA +3 more | 2025-01-28 |
| 11752734 | Base material for printed circuit board and printed circuit board | Issei Okada, Kenji Ohki | 2023-09-12 |
| 11465208 | Method of manufacturing copper nano-ink and copper nano-ink | Issei Okada, Hiroki Kakudo | 2022-10-11 |
| 11013113 | Base material for printed circuit board and printed circuit board | Issei Okada, Takashi Kasuga, Yoshio Oka, Kenji Ohki | 2021-05-18 |
| 10796812 | Coating liquid for forming conductive layer, method for producing conductive layer, and conductive layer | Issei Okada, Yoshio Oka, Atsushi Kimura, Kenji Ohki | 2020-10-06 |
| 10610928 | Powder for conductive material, ink for conductive material, conductive paste, and method for producing powder for conductive material | Issei Okada, Yoshio Oka, Kenji Ohki | 2020-04-07 |
| 10143083 | Substrate for printed circuit board and method for producing substrate for printed circuit board | Takashi Kasuga, Yoshio Oka, Shigeaki UEMURA, Jinjoo Park, Hiroshi Ueda +1 more | 2018-11-27 |