Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12213249 | Method for manufacturing dielectric sheet, method for manufacturing substrate for high-frequency printed wiring board, dielectric sheet, and substrate for high-frequency printed wiring board | Takashi Ninomiya, Motohiko SUGIURA, Yasuhiro Okuda, Hideki Kashihara, Satoshi KIYA +3 more | 2025-01-28 |
| RE49929 | Substrate for high-frequency printed wiring board | Masaaki Yamauchi, Kentaro Okamoto, Satoshi KIYA, Kazuo Murata | 2024-04-16 |
| 10485102 | Substrate for high-frequency printed wiring board | Masaaki Yamauchi, Kentaro Okamoto, Satoshi KIYA, Kazuo Murata | 2019-11-19 |
| 10244626 | Adhesive composition for printed wiring boards, bonding film, coverlay, copper-clad laminate and printed wiring board | Takayuki Yonezawa, Jun Sugawara, Shogo Asai, Yoshifumi Uchita, Masaya Kakimoto | 2019-03-26 |
| 9343653 | Piezoelectric element including fluororesin film | Jun Sugawara, Yoshiro Tajitsu | 2016-05-17 |
| 9181464 | Adhesive resin compositions, and laminates and flexible printed wiring boards using same | Jun Sugawara, Akira Mizoguchi, Syougo Asai, Takuma Yoshisaka, Naota Uenishi | 2015-11-10 |
| 8282813 | Biosensor measurement machine, biosensor measurement system and biosensor measurement method | Toshifumi Hosoya, Moriyasu Ichino, Takahiko Kitamura, Isao Karube, Masao Gotoh +2 more | 2012-10-09 |
| 8012321 | Biosensor chip, biosensor system and measuring instrument thereof | Moriyasu Ichino, Toshifumi Hosoya, Takahiko Kitamura | 2011-09-06 |
| 6783921 | Method for etching laminated assembly including polyimide layer | Tsuyoshi Nonaka, Satoshi Koshimuta, Masato Tsurugasaki | 2004-08-31 |