Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11343918 | Method of making printed circuit board and laminated structure | Eiko Imazaki, Koji Nitta, Yoshio Oka, Hideki Matsuoka, Ippei TANAKA +1 more | 2022-05-24 |
| 10292265 | Substrate for printed circuit board, printed circuit board, and method for producing substrate for printed circuit board | Takashi Kasuga, Yoshio Oka, Shigeyoshi Nakayama, Jinjoo Park, Sumito Uehara +2 more | 2019-05-14 |
| 10143083 | Substrate for printed circuit board and method for producing substrate for printed circuit board | Motohiko SUGIURA, Takashi Kasuga, Yoshio Oka, Jinjoo Park, Hiroshi Ueda +1 more | 2018-11-27 |
| 10076028 | Substrate for printed circuit board, printed circuit board, and method for producing printed circuit board | Takashi Kasuga, Yoshio Oka, Jinjoo Park, Hiroshi Ueda, Kousuke Miura | 2018-09-11 |