Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12339398 | Lidar apparatus | Shunpei Suzuki | 2025-06-24 |
| 12164061 | Lidar device | Rentaro Akimoto | 2024-12-10 |
| 11945415 | Vehicle-mounted sensor cleaning device | Yuji Hayashi | 2024-04-02 |
| 6387809 | Method and apparatus for lapping or polishing semiconductor silicon single crystal wafer | — | 2002-05-14 |
| 6001265 | Recovery of coolant and abrasive grains used in slicing semiconductor wafers | Etsuo Kiuchi, Kazuo Hayakawa, Shingo Kaburagi, Akio Ashida, Takara Ito +1 more | 1999-12-14 |
| 5947798 | Wire saw cutting apparatus synchronizing workpiece feed speed with wire speed | — | 1999-09-07 |
| 5944584 | Apparatus and method for chamfering wafer with loose abrasive grains | — | 1999-08-31 |
| 5937844 | Method for slicing cylindrical workpieces by varying slurry conditions and wire feed rate during slicing | Etsuo Kiuchi, Kazuo Hayakawa | 1999-08-17 |
| 5927131 | Method of manufacturing wire for use in a wire saw and wire for use in a wire saw | Etsuo Kiuchi, Kazuo Hayakawa | 1999-07-27 |
| 5899744 | Method of manufacturing semiconductor wafers | Shoichi Takamizawa, Kaneyoshi Aramaki | 1999-05-04 |
| 5875769 | Method of slicing semiconductor single crystal ingot | Etsuo Kiuchi, Kazuo Hayakawa | 1999-03-02 |
| 5830369 | System for reusing oily slurry waste fluid | — | 1998-11-03 |
| 5810643 | Wire saw cutting method synchronizing workpiece feed speed with wire speed | — | 1998-09-22 |
| 5778869 | Wire saw slicing apparatus and slicing method using the same | — | 1998-07-14 |
| 5693596 | Cutting fluid, method for production thereof, and method for cutting ingot | Shingo Kaburagi, Akio Ashida, Etsuo Kiuchi, Kazuo Hayakawa | 1997-12-02 |
| 5313741 | Method of and an apparatus for slicing a single crystal ingot using an ID saw slicing machine therein | — | 1994-05-24 |
| 5269285 | Wire saw and slicing method using the same | Etsuo Kiuchi, Kazuo Hayakawa | 1993-12-14 |
| 5226403 | Method of using an ID saw slicing machine for slicing a single crystal ingot and an apparatus for carrying out the method | — | 1993-07-13 |