Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6001265 | Recovery of coolant and abrasive grains used in slicing semiconductor wafers | Kohei Toyama, Etsuo Kiuchi, Kazuo Hayakawa, Shingo Kaburagi, Akio Ashida +1 more | 1999-12-14 |