Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7513819 | Polishing apparatus and method | Toshiyuki Hayashi | 2009-04-07 |
| 6827638 | Polishing device and method | Toshiyuki Hayashi | 2004-12-07 |
| 6221814 | Aqueous compositions, aqueous cutting fluid using the same, method for preparation thereof, and cutting method using the cutting fluid | Shingo Kaburagi, Akio Ashida | 2001-04-24 |
| 6112737 | Wire saw and method of cutting work | Kazutomo Kinutani, Shigeo Kobayashi | 2000-09-05 |
| 6095129 | Tension adjusting mechanism for wire saw | Yukihiro Kanemichi | 2000-08-01 |
| 6001265 | Recovery of coolant and abrasive grains used in slicing semiconductor wafers | Kohei Toyama, Kazuo Hayakawa, Shingo Kaburagi, Akio Ashida, Takara Ito +1 more | 1999-12-14 |
| 5937844 | Method for slicing cylindrical workpieces by varying slurry conditions and wire feed rate during slicing | Kazuo Hayakawa, Kohei Toyama | 1999-08-17 |
| 5927131 | Method of manufacturing wire for use in a wire saw and wire for use in a wire saw | Kazuo Hayakawa, Kohei Toyama | 1999-07-27 |
| 5907988 | Wire saw apparatus | Kazuo Hayakawa, Kouhei Toyama | 1999-06-01 |
| 5875769 | Method of slicing semiconductor single crystal ingot | Kohei Toyama, Kazuo Hayakawa | 1999-03-02 |
| 5839425 | Method for cutting a workpiece with a wire saw | Kouhei Toyama, Kazuo Hayakawa | 1998-11-24 |
| 5715807 | Wire saw | Kouhei Toyama, Kazuo Hayakawa | 1998-02-10 |
| 5693596 | Cutting fluid, method for production thereof, and method for cutting ingot | Shingo Kaburagi, Akio Ashida, Kazuo Hayakawa, Kohei Toyama | 1997-12-02 |
| 5575189 | Roller having grooves for wire saw | Kazuo Hayakawa, Kouhei Toyama | 1996-11-19 |
| 5269285 | Wire saw and slicing method using the same | Kohei Toyama, Kazuo Hayakawa | 1993-12-14 |