Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6422067 | Slurry useful for wire-saw slicing and evaluation of slurry | Hiroshi Oishi, Keiichiro Asakawa, Junichi Matsuzaki | 2002-07-23 |
| 6221814 | Aqueous compositions, aqueous cutting fluid using the same, method for preparation thereof, and cutting method using the cutting fluid | Shingo Kaburagi, Etsuo Kiuchi | 2001-04-24 |
| 6001265 | Recovery of coolant and abrasive grains used in slicing semiconductor wafers | Kohei Toyama, Etsuo Kiuchi, Kazuo Hayakawa, Shingo Kaburagi, Takara Ito +1 more | 1999-12-14 |
| 5693596 | Cutting fluid, method for production thereof, and method for cutting ingot | Shingo Kaburagi, Etsuo Kiuchi, Kazuo Hayakawa, Kohei Toyama | 1997-12-02 |