Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6422067 | Slurry useful for wire-saw slicing and evaluation of slurry | Hiroshi Oishi, Junichi Matsuzaki, Akio Ashida | 2002-07-23 |
| 6261166 | Wire cleaning apparatus | Hiroshi Oishi, Junichi Matsuzaki, Shinnji Shibaoka, Shigeru Okubo | 2001-07-17 |
| 6237585 | Wire-sawing machine | Hiroshi Oishi, Junichi Matsuzaki | 2001-05-29 |
| 6234160 | Abnormality transmission system for wire saw | Shinji Nagatsuka, Hiroo Unozawa, Hiroshi Oishi, Junichi Matsuzaki | 2001-05-22 |
| 6178961 | Wire saw control method and wire saw | Shinji Nagatsuka, Shigeru Okubo, Hiroshi Kawarai, Hiroshi Oishi, Junichi Matsuzaki | 2001-01-30 |
| 6065461 | Ingot slicing method and apparatus therefor | Hiroshi Oishi | 2000-05-23 |
| 6004405 | Wafer having a laser mark on chamfered edge | Hiroshi Oishi | 1999-12-21 |
| 5993292 | Production of notchless wafer | Hiroshi Oishi | 1999-11-30 |