Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7596604 | Email information providing server, email information providing system, email information providing method and email information providing program | Nobuo Kawakami, Masato Horinouchi | 2009-09-29 |
| 7513967 | Molded fiber materials and methods and apparatus for making the same | Takehiro Kato, Kumiko Sango, Masato Nomura | 2009-04-07 |
| 6001265 | Recovery of coolant and abrasive grains used in slicing semiconductor wafers | Kohei Toyama, Etsuo Kiuchi, Shingo Kaburagi, Akio Ashida, Takara Ito +1 more | 1999-12-14 |
| 5937844 | Method for slicing cylindrical workpieces by varying slurry conditions and wire feed rate during slicing | Etsuo Kiuchi, Kohei Toyama | 1999-08-17 |
| 5927131 | Method of manufacturing wire for use in a wire saw and wire for use in a wire saw | Etsuo Kiuchi, Kohei Toyama | 1999-07-27 |
| 5907988 | Wire saw apparatus | Etsuo Kiuchi, Kouhei Toyama | 1999-06-01 |
| 5875769 | Method of slicing semiconductor single crystal ingot | Kohei Toyama, Etsuo Kiuchi | 1999-03-02 |
| 5839425 | Method for cutting a workpiece with a wire saw | Kouhei Toyama, Etsuo Kiuchi | 1998-11-24 |
| 5715807 | Wire saw | Kouhei Toyama, Etsuo Kiuchi | 1998-02-10 |
| 5693596 | Cutting fluid, method for production thereof, and method for cutting ingot | Shingo Kaburagi, Akio Ashida, Etsuo Kiuchi, Kohei Toyama | 1997-12-02 |
| 5660650 | Method and apparatus for correcting the hardening deformation of annular elements | Shigeru Okita, Shizuo Mitsuhashi, Akihiro Kiuchi | 1997-08-26 |
| 5575189 | Roller having grooves for wire saw | Etsuo Kiuchi, Kouhei Toyama | 1996-11-19 |
| 5269285 | Wire saw and slicing method using the same | Kohei Toyama, Etsuo Kiuchi | 1993-12-14 |
| 4259456 | Odorless polyolefin resin compositions | Hisashi Yamada, Masayuki Makise | 1981-03-31 |