HY

Hiroyuki Yasuda

SC Shin-Etsu Chemical Co.: 32 patents #121 of 2,176Top 6%
SO Sony: 21 patents #1,931 of 25,231Top 8%
HH Hitachi High-Technologies: 9 patents #533 of 1,917Top 30%
SH Shimadzu: 7 patents #241 of 2,007Top 15%
MC Maruzen Petrochemical Co.: 5 patents #17 of 174Top 10%
UN Unknown: 4 patents #4,220 of 83,584Top 6%
NC N.E. Chemcat: 3 patents #29 of 136Top 25%
Mitsubishi Electric: 3 patents #8,691 of 25,717Top 35%
SC Sumitomo Bakelite Co.: 3 patents #131 of 790Top 20%
CC Citizen Systems Japan Co.: 2 patents #13 of 40Top 35%
Honda Motor Co.: 2 patents #8,527 of 21,052Top 45%
CC Citizen Watch Co.: 2 patents #460 of 1,225Top 40%
HE Hitachi Kokusai Electric: 2 patents #354 of 843Top 45%
SC Shin-Etsu Polymer Co.: 1 patents #156 of 269Top 60%
Fujitsu Limited: 1 patents #14,843 of 24,456Top 65%
AT Agency Of Industrial Science And Technology: 1 patents #568 of 1,778Top 35%
JS Jsr: 1 patents #649 of 1,137Top 60%
NC Nippon Electric Glass Co.: 1 patents #229 of 437Top 55%
IC Ibiden Co.: 1 patents #451 of 730Top 65%
WI Wako Pure Chemical Industries: 1 patents #164 of 377Top 45%
Overall (All Time): #14,324 of 4,157,543Top 1%
100
Patents All Time

Issued Patents All Time

Showing 51–75 of 100 patents

Patent #TitleCo-InventorsDate
9941145 Wafer processing temporary bonding arrangement, wafer processing laminate, and thin wafer manufacturing method Masahito Tanabe, Michihiro Sugo 2018-04-10
9934996 Wafer processing bonding arrangement, wafer laminate, and thin wafer manufacturing method Michihiro Sugo, Shohei Tagami, Masahito Tanabe 2018-04-03
9884979 Temporary adhesion method and method for producing thin wafer Michihiro Sugo, Masahito Tanabe 2018-02-06
9856229 Method for producing cyclic carbonate Toshikazu Takahashi, Shouji Yamamoto, Takashi Naniki, Yasunori Hayashi, Takeshi Haruna +1 more 2018-01-02
9834536 Method for producing catalyst for cyclic carbonate synthesis Toshikazu Takahashi, Toshiyasu Sakakura, Shouji Yamamoto, Takashi Naniki, Takuro Furukawa 2017-12-05
9796892 Silicone adhesive composition and solid-state imaging device Kyoko Soga, Michihiro Sugo 2017-10-24
9646868 Wafer temporary bonding method and thin wafer manufacturing method Michihiro Sugo, Shohei Tagami, Masahito Tanabe 2017-05-09
9616418 Metal complex and supported metal complex having disiloxane as ligand, method for production therefor, and supported metal catalyst prepared by using the same Jun-Chul Choi, Norihisa Fukaya 2017-04-11
9586927 Method for continuously producing cyclic carbonate Takashi Naniki, Yasunori Hayashi, Goro Sawada, Takuro Furukawa, Takeshi Haruna +2 more 2017-03-07
9550931 Temporary adhesive material for wafer, film for temporary adhesion using same, wafer processing laminate, and method for producing thin wafer using same Michihiro Sugo 2017-01-24
9472438 Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin wafer Kazunori Kondo, Hideto Kato, Michihiro Sugo, Shohei Tagami 2016-10-18
9458365 Temporary bonding adhesive compositions and methods of manufacturing a semiconductor device using the same Tae Hoon Kim, Hideto Kato, Jae-Hyun Kim, Jun-Won Han, Shohei Tagami +2 more 2016-10-04
9418825 Method and device for mass spectrometry Shinya Ito, Akira Fujii, Yasushi Terui 2016-08-16
9403459 Supporting unit structure of vehicle seat Takashi Kondo, Shinobu Sato, Naoyuki Saruwatari, Tomoyuki Honda, Tomomi Kitsugi 2016-08-02
9346990 Temporary adhesive material for wafer processing, wafer processing laminate, and method for manufacturing thin wafer using same Michihiro Sugo 2016-05-24
9334424 Temporary adhesive for wafer processing, member for wafer processing using the same, wafer processed body, and method for producing thin wafer Masahito Tanabe, Michihiro Sugo, Shohei Tagami, Hideto Kato 2016-05-10
9263333 Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin wafer Michihiro Sugo, Hideto Kato, Shohei Tagami, Masahito Tanabe 2016-02-16
9224225 Mass spectrometry data processing device 2015-12-29
9096032 Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing method Hideto Kato, Michihiro Sugo, Shohei Tagami 2015-08-04
9063421 Chemically amplified positive resist composition and pattern forming process Katsuya Takemura, Shohei Tagami 2015-06-23
9006581 Printed wiring board and method of manufacture thereof Toshiyuki Kawaguchi, Kazutoki Tahara, Tsutomu Saga 2015-04-14
8999817 Wafer process body, wafer processing member, wafer processing temporary adhesive material, and method for manufacturing thin wafer Shohei Tagami, Michihiro Sugo, Masahiro Furuya, Hideto Kato 2015-04-07
8980525 Chemically amplified positive resist composition and patterning process Katsuya Takemura 2015-03-17
8968982 Chemically amplified positive resist composition and patterning process Katsuya Takemura 2015-03-03
8829434 Mass spectrometer and mass spectrometry method Shinji Yoshioka 2014-09-09