Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368070 | LDMOS device having isolation regions comprising DTI regions extending from a bottom of STI region | Chun-Chieh Fang, Chien-Chang Huang, Chi-Yuan Wen, Jian Wu, Ming-Chi Wu +3 more | 2025-07-22 |
| 12051665 | Hybridization bumps for fine pitch sensor arrays | Sungjin Kim, Paul L. Bereznycky, Michael John Evans, De Hsin Chang, Wei Zhang | 2024-07-30 |
| 11862721 | HEMT semiconductor device with a stepped sidewall | Yulong Zhang, Jue OUYANG, Jheng-Sheng YOU | 2024-01-02 |
| 11495631 | Pin mesa diodes with over-current protection | Douglas Stewart Malchow, Michael John Evans, John Liobe, Wei Zhang | 2022-11-08 |
| 11251219 | Low capacitance photo detectors | Wei Zhang, Douglas Stewart Malchow, John Liobe, Michael John Evans | 2022-02-15 |
| 11251210 | Pin diodes with over-current protection | Douglas Stewart Malchow, Michael John Evans, John Liobe, Wei Zhang | 2022-02-15 |
| 10971531 | Pixels | Prabhu Mushini | 2021-04-06 |
| 10957733 | Interconnect bump structures for photo detectors | Wei Zhang, Douglas Stewart Malchow, Michael John Evans, Paul L. Bereznycky, Namwoong Paik | 2021-03-23 |
| 10879204 | Bump structures for high density flip chip interconnection | Wei Zhang, Joshua Lund, Namwoong Paik | 2020-12-29 |
| 10727267 | Interconnect bump structures for photo detectors | Wei Zhang, Douglas Stewart Malchow, Michael John Evans, Paul L. Bereznycky, Namwoong Paik | 2020-07-28 |
| 10622324 | Bump structures for high density flip chip interconnection | Wei Zhang, Joshua Lund, Namwoong Paik | 2020-04-14 |
| 10566371 | Bump structures for interconnecting focal plane arrays | Namwoong Paik | 2020-02-18 |
| 10529753 | Pixels | Prabhu Mushini | 2020-01-07 |
| 10468437 | Mesas and implants in two-dimensional arrays | Wei Zhang, Joshua Lund, Namwoong Paik | 2019-11-05 |
| 10157944 | CMOS image sensor structure | Chien-Chang Huang, Yen-Hsiang Hsu, Yu-Lung Yeh, Chun-Chieh Fang | 2018-12-18 |
| 10096639 | Bump structures for interconnecting focal plane arrays | Namwoong Paik | 2018-10-09 |
| 9716123 | Photodiode arrays | Prabhu Mushini | 2017-07-25 |
| 9666619 | CMOS image sensor structure | Chien-Chang Huang, Yen-Hsiang Hsu, Yu-Lung Yeh, Chun-Chieh Fang | 2017-05-30 |
| 9040891 | Image device and methods of forming the same | U-Ting Chen, Dun-Nian Yaung, Jen-Cheng Liu, Yu-Hao Shih, Chih-Chien Wang +2 more | 2015-05-26 |
| 8258545 | Integrated circuit including a bipolar transistor and methods of making the same | Chun-Tsung Kuo, Shih-Chang Liu, Yeur-Luen Tu | 2012-09-04 |