Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051665 | Hybridization bumps for fine pitch sensor arrays | Wei Huang, Sungjin Kim, Paul L. Bereznycky, Michael John Evans, Wei Zhang | 2024-07-30 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051665 | Hybridization bumps for fine pitch sensor arrays | Wei Huang, Sungjin Kim, Paul L. Bereznycky, Michael John Evans, Wei Zhang | 2024-07-30 |