Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12051665 | Hybridization bumps for fine pitch sensor arrays | Wei Huang, Sungjin Kim, Michael John Evans, De Hsin Chang, Wei Zhang | 2024-07-30 |
| 11923470 | Visible-swir hyper spectral photodetectors with reduced dark current | Wei Zhang, Douglas Stewart Malchow, Michael John Evans, Sean T. Houlihan | 2024-03-05 |
| 10957733 | Interconnect bump structures for photo detectors | Wei Zhang, Douglas Stewart Malchow, Michael John Evans, Wei Huang, Namwoong Paik | 2021-03-23 |
| 10727267 | Interconnect bump structures for photo detectors | Wei Zhang, Douglas Stewart Malchow, Michael John Evans, Wei Huang, Namwoong Paik | 2020-07-28 |