Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12065746 | Substrate processing method and substrate processing apparatus | Yasutoshi Okuno, Masaki Inaba | 2024-08-20 |
| 11660644 | Substrate processing method and substrate processing device | Hiroaki Takahashi | 2023-05-30 |
| 11260436 | Substrate processing apparatus and substrate processing method | Naoyuki Osada, Takahiro Yamaguchi, Eri Fujita, Ayumi HIGUCHI, Shota IWAHATA | 2022-03-01 |
| 11018017 | Substrate treatment method | Ayumi HIGUCHI | 2021-05-25 |
| 10892177 | Substrate processing method and substrate processing apparatus | Yuya AKANISHI | 2021-01-12 |
| 10755951 | Substrate processing apparatus and substrate processing method | Kenji IZUMOTO, Takemitsu MIURA, Kenji Kobayashi, Kazuhide Saito | 2020-08-25 |
| 10717117 | Substrate processing apparatus and substrate processing method | Naoyuki Osada, Takahiro Yamaguchi, Eri Fujita, Ayumi HIGUCHI, Shota IWAHATA | 2020-07-21 |
| 10622204 | Substrate processing apparatus and substrate processing method | Ayumi HIGUCHI | 2020-04-14 |
| 9997382 | Substrate processing apparatus and substrate processing method | Kenji IZUMOTO, Takemitsu MIURA, Kenji Kobayashi, Kazuhide Saito | 2018-06-12 |
| 8994183 | Multilayer interconnects with an extension part | Michiya Takahashi, Akira Ueki, Chikako Chida, Dai Motojima | 2015-03-31 |
| 7977239 | Semiconductor device and method for fabricating the same | — | 2011-07-12 |
| 7843073 | Semiconductor device and method for fabricating the same | — | 2010-11-30 |
| 7605085 | Method of manufacturing interconnecting structure with vias | Kazuo Tomita, Keiji Hashimoto, Yasutaka Nishioka, Susumu Matsumoto, Mitsuru Sekiguchi | 2009-10-20 |