Issued Patents All Time
Showing 26–37 of 37 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| D528998 | Light-emitting diode | Jae Ky Roh | 2006-09-26 |
| D522468 | Light-emitting diode | — | 2006-06-06 |
| D521951 | Light-emitting diode | — | 2006-05-30 |
| 6552423 | Higher-density memory card | Young-Shin Kwon, Kun-Dae Youm, Young Soo Kim | 2003-04-22 |
| 6087722 | Multi-chip package | Kwan-Jai Lee, Do Soo Jeong, Tae-Je Cho, Suk Chang, Chang-Cheol Lee +2 more | 2000-07-11 |
| 5923957 | Process for manufacturing a lead-on-chip semiconductor device package having a discontinuous adhesive layer formed from liquid adhesive | Jeong-Woo Seo, Seung Ho Ann, Chan Hwang | 1999-07-13 |
| 5897339 | Lead-on-chip semiconductor device package having an adhesive layer formed from liquid adhesive and method for manufacturing the same | Se-Yong Oh, Tae-Je Cho, Seung Ho Ahn, Min Ho Lee | 1999-04-27 |
| 5849607 | Process for attaching a lead frame to a semiconductor chip | Dong Soo Seo, Wan Choi, Jae Myung Park | 1998-12-15 |
| 5834832 | Packing structure of semiconductor packages | Young Do Kweon, Jung Jin Kim, Young-Hee Song, Joung-Rhang Lee | 1998-11-10 |
| 5776799 | Lead-on-chip type semiconductor chip package using an adhesive deposited on chip active surfaces at a wafer level and method for manufacturing same | Jeong-Woo Seo, Kyung Seop Kim | 1998-07-07 |
| 5710064 | Method for manufacturing a semiconductor package | Jeong-Woo Seo, Wan Choi | 1998-01-20 |
| 5559305 | Semiconductor package having adjacently arranged semiconductor chips | Chung Woo Lee, Dong Soo Seo, Jung II Park | 1996-09-24 |