JK

Jin Su Kim

Samsung: 36 patents #3,162 of 75,807Top 5%
CI Corning Incorporated: 25 patents #154 of 3,867Top 4%
LC Lg Innotek Co.: 25 patents #73 of 2,133Top 4%
SH Sk Hynix: 9 patents #856 of 4,849Top 20%
LG: 5 patents #7,897 of 26,165Top 35%
MA Morpheus Ag: 3 patents #1 of 12Top 9%
SH Samyang Holdings: 2 patents #54 of 236Top 25%
HE Hynix (Hyundai Electronics): 2 patents #415 of 1,604Top 30%
KS Korea Institute Of Radiological & Medical Sciences: 2 patents #20 of 118Top 20%
RU Research & Business Foundation Sungkyunkwan University: 1 patents #708 of 1,975Top 40%
📍 Seoul, NY: #7 of 112 inventorsTop 7%
Overall (All Time): #11,868 of 4,157,543Top 1%
110
Patents All Time

Issued Patents All Time

Showing 51–75 of 110 patents

Patent #TitleCo-InventorsDate
10727212 Semiconductor package Seon Hee Moon, Myung Sam Kang, Young Gwan Ko, Chang Bae Lee 2020-07-28
10567661 Electronic apparatus and controlling method thereof 2020-02-18
10522497 Fan-out semiconductor package Jeong Ho Lee, Bong Ju Cho, Young Gwan Ko, Shang Hoon Seo, Jeong Il LEE 2019-12-31
10504825 Fan-out semiconductor package Jeong Il LEE, Jeong Ho Lee, Bong Ju Cho 2019-12-10
10475776 Fan-out semiconductor package module Yeong A Kim, Eun Sil Kim, Young Gwan Ko, Akihisa Kuroyanagi, Jun Woo Myung 2019-11-12
10475748 Fan-out semiconductor package Jeong Ho Lee, Myung Sam Kang, Young Gwan Ko, Shang Hoon Seo 2019-11-12
10457595 Laser welded glass packages Heather Debra Boek, Leonard Charles Dabich, II, David Alan Deneka, Shari Elizabeth Koval, Stephan Lvovich Logunov +2 more 2019-10-29
10453788 Fan-out semiconductor package Jeong II LEE, Jeong Ho Lee, Bong Ju Cho 2019-10-22
10437145 Method of detaching a pellicle from a photomask Jae-Hyuck Choi, Kyoung-Mi Kim, Byung-Gook Kim 2019-10-08
10410961 Fan-out semiconductor package Jeong Ho Lee, Myung Sam Kang, Young Gwan Ko, Shang Hoon Seo, Jeong Il LEE 2019-09-10
10403579 Semiconductor device and method for manufacturing the same Han Ul Lee, Young Gwan Ko 2019-09-03
10379283 Lighting device having diffuser with array of 3D elements Jae Hyuk Jang, Seung Jong Baek, Dong Hyun Lee 2019-08-13
10347586 Fan-out semiconductor package Jeong Ho Lee, Shang Hoon Seo, Bong Ju Cho 2019-07-09
10345698 Method for fabricating semiconductor device Ji-Beom Yoo, Sung Won Kwon, Dong Wook Shin, Mun Ja Kim, Hwan Chul Jeon 2019-07-09
10347556 Passivation layer having opening for under bump metallurgy Han Ul Lee, Young Gwan Ko 2019-07-09
10338297 Lighting device using line shaped beam Jae Hyuk Jang, Seung Jong Baek, Dong Hyun Lee 2019-07-02
10317607 Optical member having three-dimensional effect forming portion and multiple effect forming portion and lighting device using the same Dong Hyun Lee, Seung Jong Baek, Jae Hyuk Jang 2019-06-11
10312195 Fan-out semiconductor package Ji Hyun Lee, Jin Gu Kim, Chang Bae Lee 2019-06-04
10253550 Vacuum insulated glass units and methodology for manufacturing the same Aize Li, Timothy James Orsley 2019-04-09
10163746 Semiconductor package with improved signal stability and method of manufacturing the same Jong In Ryu, Ki Joo Sim, Do Jae Yoo, Ki-ju Lee 2018-12-25
10151869 Optical member and lighting device using the same Seung Jong Baek, Dong Hyun Lee, Jae Hyuk Jang 2018-12-11
10125948 Optical member and lighting device using the same Seung Jong Baek, Dong Hyun Lee, Jae Hyuk Jang 2018-11-13
10128676 Method and apparatus for charging a battery Ki Wook Han 2018-11-13
10073210 Light source module and lighting device having the same Jae Hyuk Jang, Seung Jong Baek, Dong Hyun Lee 2018-09-11
10026668 Passivation layer having an opening for under bump metallurgy Han Ul Lee, Young Gwan Ko 2018-07-17