Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12028973 | Printed circuit board | Chan-Jin Park, Young Ook Cho, Hyun Seok Yang, Won Seok Lee, Mi Jeong Jeon | 2024-07-02 |
| 10163746 | Semiconductor package with improved signal stability and method of manufacturing the same | Jong In Ryu, Do Jae Yoo, Ki-ju Lee, Jin Su Kim | 2018-12-25 |
| 10109595 | Double-sided package module and substrate strip | Do Jae Yoo, Hee Jung Jung, Jong In Ryu | 2018-10-23 |