JK

Jin Su Kim

Samsung: 36 patents #3,162 of 75,807Top 5%
CI Corning Incorporated: 25 patents #154 of 3,867Top 4%
LC Lg Innotek Co.: 25 patents #73 of 2,133Top 4%
SH Sk Hynix: 9 patents #856 of 4,849Top 20%
LG: 5 patents #7,897 of 26,165Top 35%
MA Morpheus Ag: 3 patents #1 of 12Top 9%
SH Samyang Holdings: 2 patents #54 of 236Top 25%
HE Hynix (Hyundai Electronics): 2 patents #415 of 1,604Top 30%
KS Korea Institute Of Radiological & Medical Sciences: 2 patents #20 of 118Top 20%
RU Research & Business Foundation Sungkyunkwan University: 1 patents #708 of 1,975Top 40%
📍 Seoul, NY: #7 of 112 inventorsTop 7%
Overall (All Time): #11,868 of 4,157,543Top 1%
110
Patents All Time

Issued Patents All Time

Showing 101–110 of 110 patents

Patent #TitleCo-InventorsDate
D717255 Semiconductor device Jae Hyun Lim, Jin Suk Son, Jong-Man Kim, Joon Hyung Cho, Kee Ju Um +3 more 2014-11-11
8821740 Nanowire manufacturing method Young Jae Lee, Kyoung Jong Yoo, Jun Ki Lee, Jae Wan Park 2014-09-02
8800137 Method of manufacturing printed circuit board Seog Moon Choi 2014-08-12
8786064 Semiconductor package and method for manufacturing the same and semiconductor package module having the same Ji Man Ryu, Soon Gyu Yim 2014-07-22
D631464 Cellular phone 2011-01-25
D597990 Cellular phone Ho Phil Lee, Da Na Jung 2009-08-11
D573973 Mobile phone Seung Il Lee 2008-07-29
7329365 Etchant composition for indium oxide layer and etching method using the same Hong-Je Cho, Seung Yong Lee, Joon-Woo LEE, Jae Yeon Lee, Seung-Hwan Chon +5 more 2008-02-12
6188129 Stacked semiconductor chip package having external terminal pads and stackable chips having a protection layer Kyung Wook Paik, Hyoung-soo Ko 2001-02-13
6124149 Method of making stackable semiconductor chips to build a stacked chip module Kyung Wook Paik, Hyung Su Ko 2000-09-26