Issued Patents All Time
Showing 101–113 of 113 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7515562 | Apparatus and method for supporting soft handover in broadband wireless access communication system | Chi-Woo Lim, Pan-Yuh Joo, Sie-Joon Cho, Young-Bin Chang | 2009-04-07 |
| 7450909 | Apparatus and method for signal transmission and reception using downlink channel information in a sleep mode in a BWA communication system | Jung-Je Son, Chang-Hoi Koo, Pan-Yuh Joo, Yeong-Moon Son, Young-Bin Chang +4 more | 2008-11-11 |
| 7235412 | Semiconductor component having test pads and method and apparatus for testing same | Mohsen H. Mardi, Xin Wu, Chih-Chung Wu, Shih-Liang Liang, Sanjiv Stokes +1 more | 2007-06-26 |
| 6891395 | Application-specific testing methods for programmable logic devices | Robert W. Wells, Zhi-Min Ling, Robert D. Patrie, Vincent L. Tong, Shahin Toutounchi | 2005-05-10 |
| 6817006 | Application-specific testing methods for programmable logic devices | Robert W. Wells, Zhi-Min Ling, Robert D. Patrie, Vincent L. Tong, Shahin Toutounchi | 2004-11-09 |
| 6664808 | Method of using partially defective programmable logic devices | Zhi-Min Ling, Robert W. Wells, Clay S. Johnson, Shelly Davis | 2003-12-16 |
| 6594797 | Methods and circuits for precise edge placement of test signals | Rick W. Dudley, Robert D. Patrie, Robert W. Wells | 2003-07-15 |
| 6376131 | Methods and structures for protecting reticles from ESD failure | Zhi-Min Ling, Xin Wu | 2002-04-23 |
| 6087718 | Stacking type semiconductor chip package | — | 2000-07-11 |
| 5958270 | Wire bonding wedge tool with electric heater | — | 1999-09-28 |
| 5933711 | Fabrication method for chip size semiconductor package | — | 1999-08-03 |
| 5863816 | Fabrication method for chip size semiconductor package | — | 1999-01-26 |
| 5834830 | LOC (lead on chip) package and fabricating method thereof | — | 1998-11-10 |