Issued Patents All Time
Showing 26–47 of 47 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10396035 | Three-dimensional semiconductor device having contact plugs penetrating upper adjacent electrodes | — | 2019-08-27 |
| 10325992 | Semiconductor device and method of manufacturing the same | Eunae Cho, Dongjin Lee, Ji Eun Lee, Kyoung-Ho Jung, Dong Su Ko +8 more | 2019-06-18 |
| 9202819 | Three-dimensional semiconductor memory devices and methods of fabricating the same | Juyul Lee, Bumsu Kim, Kwangmin Park, Jae Young Ahn, Dongchul Yoo +2 more | 2015-12-01 |
| 7675125 | NAND-type nonvolatile memory device and related method of manufacture | Seung-Jun Lee, Hyun Jung Kim | 2010-03-09 |
| 7544896 | Forming a porous dielectric layer and structures formed thereby | Boyan Boyanov, Grant Kloster, Vijay Ramachandrarao | 2009-06-09 |
| 7335586 | Sealing porous dielectric material using plasma-induced surface polymerization | Vijayakumar Ramachandrarao, Boyan Boyanov, Grant Kloster | 2008-02-26 |
| 7332406 | Air gap interconnect structure and method | Grant Kloster | 2008-02-19 |
| 7303648 | Via etch process | Vijayakumar Ramachandrarao | 2007-12-04 |
| 7238604 | Forming thin hard mask over air gap or porous dielectric | Grant Kloster, Kevin P. O'Brien, David H. Gracias, Vijayakumar Ramachandrarao | 2007-07-03 |
| 7220668 | Method of patterning a porous dielectric material | Boyan Boyanov, Grant Kloster, Vijayakumar Ramachandrarao | 2007-05-22 |
| 7179755 | Forming a porous dielectric layer and structures formed thereby | Boyan Boyanov, Grant Kloster, Vijay Ramachandrarao | 2007-02-20 |
| 7176122 | Dielectric with sidewall passivating layer | — | 2007-02-13 |
| 7151051 | Interconnect structure for an integrated circuit and method of fabrication | Jun He, Jose Maiz | 2006-12-19 |
| 7049053 | Supercritical carbon dioxide to reduce line edge roughness | Vijayakumar Ramachandrarao, Subramanyam Iyer, Bob Turkot | 2006-05-23 |
| 6919637 | Interconnect structure for an integrated circuit and method of fabrication | Jun He, Jose Maiz | 2005-07-19 |
| 6903461 | Semiconductor device having a region of a material which is vaporized upon exposing to ultraviolet radiation | Grant Kloster, Jihperng Leu | 2005-06-07 |
| 6867125 | Creating air gap in multi-level metal interconnects using electron beam to remove sacrificial material | Grant Kloster, Jihperng Leu | 2005-03-15 |
| 6861332 | Air gap interconnect method | Grant Kloster | 2005-03-01 |
| 6774032 | Method of making a semiconductor device by forming a masking layer with a tapered etch profile | — | 2004-08-10 |
| 6743712 | Method of making a semiconductor device by forming a masking layer with a tapered etch profile | Jihperng Leu, Chih-I Wu | 2004-06-01 |
| 6734094 | Method of forming an air gap within a structure by exposing an ultraviolet sensitive material to ultraviolet radiation | Grant Kloster, Jihperng Leu | 2004-05-11 |
| 6620741 | Method for controlling etch bias of carbon doped oxide films | David H. Gracias, Vijayakumar Ramachandrarao | 2003-09-16 |