Issued Patents All Time
Showing 26–50 of 154 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8624354 | Semiconductor devices including 3-D structures with support pad structures and related methods and systems | Shin-Hye Kim, Kyung-Mun Byun, Hong-Rae Kim, Eun-Kee Hong | 2014-01-07 |
| 8592979 | Semiconductor device conductive pattern structures and methods of manufacturing the same | Hei Seung Kim, Ji-Soon Park, Jong-Myeong Lee | 2013-11-26 |
| 8592310 | Methods of manufacturing a semiconductor device | Byung-Lyul Park, Suk-Chul Bang, Kwang-Jin Moon, Dong-Chan Lim, Deok-Young Jung | 2013-11-26 |
| 8581334 | Via structures and semiconductor devices having the via structures | Dong-Chan Lim, Byung-Lyul Park, Sang-Hoon Ahn, Jong-Myeong Lee | 2013-11-12 |
| 8569862 | Integrated circuit devices with crack-resistant fuse structures | Sang-Hoon Ahn, Jong-Myeong Lee, Sang-Don Nam, Kyu-Hee Han | 2013-10-29 |
| 8547747 | Non-volatile memory device | Su Kyoung Kim, Jong-Myeong Lee, In-Sun Park, Ji-Soon Park | 2013-10-01 |
| 8546256 | Method of forming semiconductor device | Deok-Young Jung, Suk-Chul Bang, Byung-Lyul Park, Kwang-Jin Moon, Dong-Chan Lim | 2013-10-01 |
| 8546162 | Method for forming light guide layer in semiconductor substrate | Dae-Lok Bae, Byung-Lyul Park, Pil-Kyu Kang, Kwang-Jin Moon | 2013-10-01 |
| 8530329 | Methods of fabricating semiconductor devices having various isolation regions | Yong-Soon Choi, Jun Won Lee, Eun-Kee Hong, Hong-Gun Kim, Ha-young Yi | 2013-09-10 |
| 8524615 | Method of forming hardened porous dielectric layer and method of fabricating semiconductor device having hardened porous dielectric layer | Sang-Hoon Ahn, Byung-Hee Kim, Sang-Don Nam, Kyu-Hee Han, Jang-Hee Lee +2 more | 2013-09-03 |
| 8501606 | Methods of forming wiring structures | Eun-Ok Lee, Dae-Yong Kim, Byung-Hee Kim | 2013-08-06 |
| 8497207 | Methods of forming semiconductor devices including landing pads formed by electroless plating | Jong-Ho Yun, Jong-Myeong Lee | 2013-07-30 |
| 8497157 | Method of manufacturing a semiconductor device and method of manufacturing a semiconductor package including the same | Kwang-Jin Moon, Byung-Lyul Park, Do-Sun Lee, Suk-Chul Bang, Dong-Chan Lim +1 more | 2013-07-30 |
| 8492223 | Methods of manufacturing flash memory devices by selective removal of nitrogen atoms | Jong Wan Choi, Wan-sik Hwang, Eunkee Hong, Ju-Seon Goo, Bo-Young Lee | 2013-07-23 |
| 8486783 | Semiconductor device and method of manufacturing the same | Woong-Hee Sohn, Byung-Hee Kim, Dae-Yong Kim, Min-sang Song, Kwang-Jin Moon +4 more | 2013-07-16 |
| 8476763 | Semiconductor device conductive pattern structures including dummy conductive patterns | Hei Seung Kim, In-Sun Park, Ji-Soon Park, Jong-Myeong Lee, Jong-Won Hong | 2013-07-02 |
| 8466556 | Semiconductor device and method of manufacturing the same | Jin-Ho Park, Sang-Woo Lee, Ho Lee | 2013-06-18 |
| 8466052 | Method of fabricating semiconductor device having buried wiring | Jong-Min Baek, Hee-Sook Park, Seong-Hwee Cheong, Byung-Hak Lee, Tae-Ho Cha +2 more | 2013-06-18 |
| 8422845 | Optical input/output device for photo-electric integrated circuit device and method of fabricating same | Pil-Kyu Kang, Dae-Lok Bae, Jong-Myeong Lee | 2013-04-16 |
| 8404579 | Methods of forming integrated circuit devices with crack-resistant fuse structures | Sang-Hoon Ahn, Jong-Myeong Lee, Sang-Don Nam, Kyu-Hee Han | 2013-03-26 |
| 8404576 | Methods of forming a gate structure | Tae-Ho Cha, Seong-Hwee Cheong, Byung-Hee Kim, Hee-Sook Park, Jong-Min Baek | 2013-03-26 |
| 8390120 | Semiconductor device and method of fabricating the same | Kwang-Jin Moon, Pil-Kyu Kang, Dae-Lok Bae, Byung-Lyul Park, Dong-Chan Lim +1 more | 2013-03-05 |
| 8367535 | Method of fabricating semiconductor device | Yong-Soon Choi, Ha-young Yi, Eunkee Hong, Sang-Hoon Ahn | 2013-02-05 |
| 8367533 | Semiconductor devices including doped metal silicide patterns and related methods of forming such devices | Jung Ho Yun, Jong-Myeong Lee | 2013-02-05 |
| 8354308 | Conductive layer buried-type substrate, method of forming the conductive layer buried-type substrate, and method of fabricating semiconductor device using the conductive layer buried-type substrate | Pil-Kyu Kang, Dae-Lok Bae, Byung-Lyul Park, Dong-kak Lee | 2013-01-15 |