Issued Patents All Time
Showing 26–50 of 64 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9455353 | Substrate with multiple encapsulated devices | Po-Jui Chen, Matthieu Liger, Andrew Graham | 2016-09-27 |
| 9423303 | MEMS infrared sensor including a plasmonic lens | Ashwin Samarao, Gary O'Brien, Ando Feyh, Fabian Purkl | 2016-08-23 |
| 9368658 | Serpentine IR sensor | Fabian Purkl, Ando Feyh, Gary O'Brien | 2016-06-14 |
| 9257587 | Suspension and absorber structure for bolometer | Fabian Purkl, Ando Feyh | 2016-02-09 |
| 9255328 | Metamaterial and method for forming a metamaterial using atomic layer deposition | Fabian Purkl, John Provine, Ando Feyh, Gary O'Brien | 2016-02-09 |
| 9242850 | Out-of-plane spacer defined electrode | Andrew Graham, Gary O'Brien | 2016-01-26 |
| 9233842 | Passivation layer for harsh environments and methods of fabrication thereof | Ando Feyh, Fabian Purkl, Andrew Graham | 2016-01-12 |
| 9236522 | MEMS infrared sensor including a plasmonic lens | Ashwin Samarao, Gary O'Brien, Ando Feyh, Fabian Purkl | 2016-01-12 |
| 9199838 | Thermally shorted bolometer | Gary O'Brien, Fabian Purkl, Ando Feyh, Bongsang Kim, Ashwin Samarao +1 more | 2015-12-01 |
| 9187314 | Anisotropic conductor and method of fabrication thereof | Ando Feyh, Fabian Purkl, Ashwin Samarao, Gary O'Brien | 2015-11-17 |
| 9130081 | Bolometer having absorber with pillar structure for thermal shorting | Fabian Purkl, Ando Feyh | 2015-09-08 |
| 9093594 | Multi-stack film bolometer | Ando Feyh, Po-Jui Chen, Fabian Purkl, Gary O'Brien | 2015-07-28 |
| 9073749 | Structured gap for a MEMS pressure sensor | Andrew Graham, Gary O'Brien | 2015-07-07 |
| 9064982 | Thin-film encapsulated infrared sensor | Fabian Purkl, Ando Feyh, Andrew Graham, Ashwin Samarao, Gary O'Brien | 2015-06-23 |
| 9064800 | Method of manufacturing a sensor device having a porous thin-film metal electrode | Ando Feyh, Gary O'Brien, Fabian Purkl, Ashwin Samarao | 2015-06-23 |
| 9003885 | Tri-axis accelerometer having a single proof mass and fully differential output signals | Zhiyu Pan, Christoph Lang, Matthias Metz, Markus Ulm | 2015-04-14 |
| 8933535 | Wafer with spacer including horizontal member | Andrew Graham, Gary O'Brien | 2015-01-13 |
| 8906730 | Method of forming membranes with modified stress characteristics | Andrew Graham, Gary O'Brien | 2014-12-09 |
| 8900906 | Atomic layer deposition strengthening members and method of manufacture | Fabian Purkl, Matthieu Liger, Matthias Illing | 2014-12-02 |
| 8890283 | Wafer with recessed plug | Andrew Graham, Gary O'Brien | 2014-11-18 |
| 8878314 | MEMS package or sensor package with intra-cap electrical via and method thereof | Andrew Graham, Gary O'Brien | 2014-11-04 |
| 8673756 | Out-of-plane spacer defined electrode | Andrew Graham, Gary O'Brien | 2014-03-18 |
| 8647930 | Wafer with recessed plug | Andrew Graham, Gary O'Brien | 2014-02-11 |
| 8580691 | Method of forming non-planar membranes using CMP | Andrew Graham, Gary O'Brien | 2013-11-12 |
| 8426289 | Wafer with spacer including horizontal member | Andrew Graham, Gary O'Brien | 2013-04-23 |