Issued Patents All Time
Showing 26–42 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8420721 | Polyolefin resin composition | Tsuyoshi Urushihara, Naoshi Kawamoto | 2013-04-16 |
| 8288462 | Polyolefin resin composition | Tsuyoshi Urushihara, Kazukiyo Nomura, Yota Tsuneizumi | 2012-10-16 |
| 7519625 | Snapshot management apparatus and method, and storage system | Koji Honami, Motoaki Satoyama, Naohiro Fujii | 2009-04-14 |
| 7501710 | Semiconductor integrated circuit and method of manufacturing the same | Shigeru Nonoyama | 2009-03-10 |
| 6768516 | Semiconductor device constituting a CMOS camera system | Satoshi Yamada, Michitaka Kimura, Masatoshi Yasunaga | 2004-07-27 |
| 6623113 | Inkjet recording head including electrode assembly for deflecting ink droplets | Takahiro Yamada, Hitoshi Kida, Kunio Satou, Shinya Kobayashi | 2003-09-23 |
| 6130484 | Semiconductor device | Hideo Kameda, Yoichi Goi, Hideki Taniguchi | 2000-10-10 |
| 5900582 | Lead frame including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the lead frame | Yoshihiro Tomita, Yoshirou Nishinaka, Shunichi Abe, Hideyuki Ichiyama | 1999-05-04 |
| 5763829 | Leadframe including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the leadframe | Yoshihiro Tomita, Yoshirou Nishinaka, Shunichi Abe, Hideyuki Ichiyama | 1998-06-09 |
| 5724726 | Method of making leadframe for lead-on-chip (LOC) semiconductor device | Yoshihiro Tomita, Yoshirou Nishinaka, Shunichi Abe, Hideyuki Ichiyama | 1998-03-10 |
| RE35496 | Semiconductor device and method of producing the same | Ken Yamamura, Kazunari Michii, Hitoshi Fujimoto, Kiyoaki Tsumura, Hitoshi Sasaki +1 more | 1997-04-29 |
| 5609287 | Solder material, junctioning method, junction material, and semiconductor device | Goro Izuta, Shunichi Abe, Yoshirou Nishinaka, Katsuyuki Fukutome, Toshio Takeuchi +2 more | 1997-03-11 |
| 5535509 | Method of making a lead on chip (LOC) semiconductor device | Yoshihiro Tomita, Yoshirou Nishinaka, Shunichi Abe, Hideyuki Ichiyama | 1996-07-16 |
| 5508232 | Method of manufacturing a semiconductor device | Tetsuya Ueda, Kazunari Michii, Yutaka Koyama | 1996-04-16 |
| 5372295 | Solder material, junctioning method, junction material, and semiconductor device | Shunichi Abe, Katunori Asai, Yoshihiro Tomita, Hideyuki Ichiyama, Seizou Ohumae +3 more | 1994-12-13 |
| 5334803 | Semiconductor device and method of producing the same | Ken Yamamura, Kazunari Michii, Hitoshi Fujimoto, Kiyoaki Tsumura, Hitoshi Sasaki +1 more | 1994-08-02 |
| 5242099 | Method of die bonding semiconductor chip | — | 1993-09-07 |