SH

Stefan Leopold Hatzl

RP Rf360 Singapore Pte.: 4 patents #7 of 118Top 6%
QU Qualcomm: 3 patents #4,487 of 12,104Top 40%
EA Epcos Ag: 2 patents #202 of 606Top 35%
Overall (All Time): #534,223 of 4,157,543Top 15%
9
Patents All Time

Issued Patents All Time

Showing 1–9 of 9 patents

Patent #TitleCo-InventorsDate
12341488 Package comprising an acoustic device and a polymer cap layer Sebastian Brunner, Changhan Hobie Yun, Manuel Hofer, Horst Droescher, Christian Hoffmann 2025-06-24
12334909 Multi-level stacked acoustic wave (AW) filter packages and related fabrication methods Manuel Hofer, Xavier Perois, Michael Wick, Jeroen Bielen, Juergen Portmann 2025-06-17
12316304 Vertically coupled SAW resonators Stefan Ammann, Matthias PERNPEINTNER, Manuel Hofer 2025-05-27
12261583 Stacked acoustic wave (AW) filter packages, including cross-talk reduction layers, and related fabrication methods Simone Colasanti, Nadine Erhard-Egeler, Manuel Hofer, Peter Kirchhofer, Volker Schulz 2025-03-25
12071339 Micro-acoustic wafer-level package and method of manufacture Manuel Hofer, Rodrigo PACHER FERNANDES, Josef EHGARTNER, Peter Bainschab 2024-08-27
10582609 Integration of through glass via (TGV) filter and acoustic filter Changhan Hobie Yun, Jonghae Kim, Xiaoju YU, Mario Francisco Velez, Wei-Chuan Chen +7 more 2020-03-03
10117329 Carrier plate, device having the carrier plate and method for producing a carrier plate Sebastian Brunner 2018-10-30
9287247 Light-emitting diode arrangement, module, and method for producing a light-emitting diode arrangement Christian Faistauer, Sebastian Brunner 2016-03-15
9001523 Carrier device, arrangement comprising such a carrier device, and method for patterning a layer stack comprising at least one ceramic layer Sebastian Brunner, Gerhard Fuchs, Annette Fischer, Manfred Fischer, Christian Faistauer +2 more 2015-04-07