JE

Josef EHGARTNER

RP Rf360 Singapore Pte.: 1 patents #47 of 118Top 40%
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Patent #TitleCo-InventorsDate
12071339 Micro-acoustic wafer-level package and method of manufacture Manuel Hofer, Rodrigo PACHER FERNANDES, Stefan Leopold Hatzl, Peter Bainschab 2024-08-27