Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12071339 | Micro-acoustic wafer-level package and method of manufacture | Manuel Hofer, Rodrigo PACHER FERNANDES, Stefan Leopold Hatzl, Josef EHGARTNER | 2024-08-27 |
| 10582609 | Integration of through glass via (TGV) filter and acoustic filter | Changhan Hobie Yun, Jonghae Kim, Xiaoju YU, Mario Francisco Velez, Wei-Chuan Chen +7 more | 2020-03-03 |