Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341488 | Package comprising an acoustic device and a polymer cap layer | Sebastian Brunner, Changhan Hobie Yun, Stefan Leopold Hatzl, Horst Droescher, Christian Hoffmann | 2025-06-24 |
| 12334909 | Multi-level stacked acoustic wave (AW) filter packages and related fabrication methods | Xavier Perois, Michael Wick, Jeroen Bielen, Stefan Leopold Hatzl, Juergen Portmann | 2025-06-17 |
| 12316304 | Vertically coupled SAW resonators | Stefan Ammann, Matthias PERNPEINTNER, Stefan Leopold Hatzl | 2025-05-27 |
| 12261583 | Stacked acoustic wave (AW) filter packages, including cross-talk reduction layers, and related fabrication methods | Simone Colasanti, Nadine Erhard-Egeler, Stefan Leopold Hatzl, Peter Kirchhofer, Volker Schulz | 2025-03-25 |
| 12071339 | Micro-acoustic wafer-level package and method of manufacture | Rodrigo PACHER FERNANDES, Stefan Leopold Hatzl, Josef EHGARTNER, Peter Bainschab | 2024-08-27 |
| 10582609 | Integration of through glass via (TGV) filter and acoustic filter | Changhan Hobie Yun, Jonghae Kim, Xiaoju YU, Mario Francisco Velez, Wei-Chuan Chen +7 more | 2020-03-03 |