Issued Patents All Time
Showing 26–50 of 80 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11251170 | Package structure and manufacturing method thereof | Shang-Yu Chang Chien, Nan-Chun Lin | 2022-02-15 |
| 11211350 | Semiconductor package and manufacturing method thereof | Shang-Yu Chang Chien, Nan-Chun Lin | 2021-12-28 |
| 11211321 | Package structure and manufacturing method thereof | Shang-Yu Chang Chien, Nan-Chun Lin | 2021-12-28 |
| 11171106 | Semiconductor package structure with circuit substrate and manufacturing method thereof | Nan-Chun Lin, Shang-Yu Chang Chien | 2021-11-09 |
| 11127699 | Chip package structure and manufacturing method thereof | Nan-Chun Lin, Shang-Yu Chang Chien | 2021-09-21 |
| 11097906 | Liquid withdrawal system | Yan-Lan Chiou | 2021-08-24 |
| 11094654 | Package structure and method of manufacturing the same | Nan-Chun Lin, Shang-Yu Chang Chien | 2021-08-17 |
| 11088100 | Semiconductor package and manufacturing method thereof | Nan-Chun Lin, Shang-Yu Chang Chien | 2021-08-10 |
| 11088080 | Chip package structure using silicon interposer as interconnection bridge | Pei-Chun Tsai, Shang-Yu Chang Chien, Nan-Chun Lin | 2021-08-10 |
| 11024603 | Manufacturing method and a related stackable chip package | Ming-Chih Chen, Yuan-Fu Lan, Chi-An Wang, Hsien-Wen Hsu | 2021-06-01 |
| 10978408 | Semiconductor package and manufacturing method thereof | Shang-Yu Chang Chien, Nan-Chun Lin | 2021-04-13 |
| 10950593 | Package structure including at least one connecting module and manufacturing method thereof | Shang-Yu Chang Chien, Nan-Chun Lin | 2021-03-16 |
| 10944165 | Integrated antenna package structure and manufacturing method thereof | Yun-Hsin Yeh | 2021-03-09 |
| 10892250 | Stacked package structure with encapsulation and redistribution layer and fabricating method thereof | Ming-Chih Chen, Yuan-Fu Lan, Hsien-Wen Hsu | 2021-01-12 |
| 10862202 | Integrated antenna package structure and manufacturing method thereof | Yun-Hsin Yeh | 2020-12-08 |
| 10840200 | Manufacturing method of chip package structure comprising encapsulant having concave surface | Li-Chih Fang, Nan-Chun Lin, Shang-Yu Chang Chien | 2020-11-17 |
| 10796931 | Manufacturing method of package structure | Han-Wen Lin, Shang-Yu Chang Chien, Nan-Chun Lin | 2020-10-06 |
| 10788205 | Atomizing system | — | 2020-09-29 |
| 10756065 | Method thereof of package structure | Shang-Yu Chang Chien, Nan-Chun Lin | 2020-08-25 |
| 10629554 | Package structure and manufacturing method thereof | Nan-Chun Lin | 2020-04-21 |
| 10629559 | Semiconductor package and manufacturing method thereof | Shang-Yu Chang Chien, Nan-Chun Lin | 2020-04-21 |
| 10593647 | Package structure and manufacturing method thereof | Shang-Yu Chang Chien, Nan-Chun Lin | 2020-03-17 |
| 10522512 | Semiconductor package and manufacturing method thereof | Shang-Yu Chang Chien, Nan-Chun Lin | 2019-12-31 |
| 10515936 | Package structure and manufacturing method thereof | Shang-Yu Chang Chien, Nan-Chun Lin | 2019-12-24 |
| 10512890 | Apparatus for mixing materials which have a high mix proportion/ratio therebetween and preparation production system using the same | Yan-Lan Chiou | 2019-12-24 |